Packaging structure

A packaging structure, packaging colloid technology, applied in electrical components, electrical solid devices, circuits, etc., can solve problems such as difficult coating amount

Active Publication Date: 2008-02-27
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although the technical solution disclosed in the Taiwan Patent No. I222705 can effectively control the height of the gap between the two substrates and avoid problems such as contamination of the operating area, the sealing frame glue is a flowable glue

Method used

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Embodiment Construction

[0019] Some embodiments of the present invention are described in detail as follows, wherein the relevant drawings referred to are not drawn according to actual scale, and the function of the drawings is only to express the structural features of the present invention. In addition, the present invention can also be widely implemented in other embodiments except the ones presented below, that is, the scope of the present invention is not limited by the embodiments, but by the scope of the claims presented in the present invention.

[0020] FIG. 2 shows a schematic top view of a substrate 200 according to an embodiment of the invention. The substrate 200, such as a semiconductor wafer, has one or more predetermined regions 202 on its upper surface, and one or more components 204 are arranged in the predetermined regions 202, that is, the predetermined region 202 can be used as, for example, a component area. The above-mentioned components 204 may include semiconductor component...

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Abstract

The present invention provides an embedding structure which includes a first and a second substrate. Upper surface of the first substrate has a certain region; a first sealing ring with a first height is located on the upper surface of the first substrate, and is set on peripheral part of the said certain region to connect lower surface of the second substrate; a second sealing ring with a second height which is smaller than the first height is located on the upper surface of the first substrate, and is set on peripheral part of the first sealing ring to form a trench with the first sealing ring together; a sealing colloid is set in the trench. The embedding structure of the present invention can effectively provide adhesion and air tightness, reduce used amount of the sealing colloid, and avoid polluting component region.

Description

【Technical field】 [0001] The present invention relates to a packaging structure, and in particular to a packaging structure that can increase adhesion and airtightness, effectively reduce the amount of packaging glue used, and avoid contamination of the component area. 【Background technique】 [0002] Since electronic components such as semiconductor components, micro-electromechanical components (MEMS), or optoelectronic components have tiny and fine circuits and structures, in order to avoid dust, acid and alkali substances, moisture and oxygen from polluting or corroding electronic components, thereby affecting their reliability And life, the process needs to use packaging technology to provide the above-mentioned electronic components with functions such as power distribution, signal distribution, heat dissipation, protection and support. [0003] Most packaging technologies separate the wafer into independent chips and then complete the packaging process, while wafer-lev...

Claims

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Application Information

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IPC IPC(8): H01L23/31
Inventor 黄正维
Owner ADVANCED SEMICON ENG INC
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