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Method for preparing line-type o-cresol novolac resin

A technology of phenolic resin and o-cresol, applied in the field of preparation of online o-cresol novolac resin, can solve the problem of wide molecular weight distribution of o-cresol novolak resin

Inactive Publication Date: 2008-02-13
CHINA PETROCHEMICAL CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a manufacturing method of linear o-cresol novolac resin, which solves the problem of wide molecular weight distribution of o-cresol novolak resin

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0011] Embodiment 1: add o-cresol 280g and 37% formaldehyde solution 120g in the reactor, heat up and dissolve, add acidic catalyst (phosphoric acid 8g, formic acid 20g), add water to adjust the pH value of the reaction system to 3. At a reaction temperature of 90°C, react for 6 hours, add 140 g of cyclohexanone as a solvent to dissolve, wash with water to pH 6-7, and recover the solvent under reduced pressure to obtain a linear o-cresol novolac resin. The reaction conditions and product results are shown in Table 1 and Table 2, respectively.

Embodiment 2～6

[0012] Embodiments 2 to 6: The operation steps are the same as in Embodiment 1, and the reaction conditions and product results are shown in Table 1 and Table 2 respectively.

[0013] Table 1: Reaction Conditions

[0014] serial number

1#

2#

3#

4#

5#

6#

formaldehyde

37% formaldehyde

Solution 120g

Paraformaldehyde

50g

Paraformaldehyde

100g

Paraformaldehyde

50g

37% formaldehyde

Solution 120g

Paraformaldehyde

100g

o-cresol

280g

540g

180g

450g

320g

360g

catalyst

Phosphoric acid 8g

Formic acid 20g

Acetic acid

18g

Oxalic acid 0.8g

Sulfuric acid 1g

Oxalic acid

21.6g

Phosphoric acid 4g

salicylic acid

12g

p-toluene sulfonate

Acid 7.2g

catalyst plus

entry me...

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PUM

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Abstract

The invention provides a manufacturing method of the linear o-cresol-formaldehyde resin with the o-cresol and formaldehyde as the raw materials; the acidic catalyst is added in batches; the water is added to adjust the pH value of the reaction system to be between 3 and 5; at the temperature of 60 to 120 Celsius system, the reaction is kept for 4 to 10 hours; the solvent is added to dissolve; the water is added until the ph value is between 6 and 7; the solvent is decompressed and recycled; then the linear o-cresol-formaldehyde resin can be made. For linear o-cresol-formaldehyde resin produced in the method, the molecular weight distribution Mw per Mn is less than 4.

Description

technical field [0001] The invention relates to a preparation method of linear o-cresol aldehyde resin. Background technique [0002] In the electronics industry, packaging is one of the necessary processes for electronic components. The packaged semiconductor components can avoid the intrusion of moisture, dust and harmful gases. It can also slow down vibration, prevent external force damage, and stabilize component parameters. important role in the electronics industry. The epoxy molding compound used for packaging is obtained by compounding novolac epoxy resin with filler, curing agent, toughening agent, etc. At present, 90% of industrial and civilian large-scale integrated circuits are packaged with epoxy molding compound. Novolac epoxy resin is the core component of molding compounds, and its performance directly affects the performance of molding compounds. In addition to requiring fast curing, low stress, good heat resistance and moisture resistance, it also require...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G8/12
Inventor 唐光斌邓海波吴际伟刘帅
Owner CHINA PETROCHEMICAL CORP
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