Container conversion device for semi-conductor packaging element

Abstract

A container conversion device of a semiconductor mounting element includes a clamp tray mechanism module and a dual-shaft rotary mechanism module. The clamp tray mechanism module includes a tray clamp, a slide way base plate and an insertion pipe mechanism. The surface of the slide way base plate is provided with a plurality of slide ways arranged on the lower surface of the tray clamp. The outlet of the slide way of the slide way base plate is provided with the insertion pipe mechanism; each material pipe insertion trough of the insertion pipe mechanism can be inserted by a material pipe. The clamp tray mechanism module is articulated with the dual-shaft rotary mechanism. When the clamp tray mechanism module at the horizontal position clamps the tray which is supported with a plurality of semiconductor mounting elements, by the rotation of 180 DEG of the second rotary shaft of the dual-shaft rotary mechanism module, each line of semiconductor mounting element on the tray is dropped into each slide way of the slide way base plate and slides into the material pipe of the insertion pipe mechanism along the slide way. The invention has the advantages of fast and easy replacement by adopting the modularization design, aiming at the semiconductor mounting elements of different types and dimensions.

Description

technical field [0001] The invention relates to a container switching device, in particular to a container switching device for semiconductor packaging components, which is used for quickly switching semiconductor packaging components placed in a tray to a tube. Background technique [0002] After the semiconductor wafer is designed and manufactured, the electrical function of the assembled product must be tested by a tester to ensure the normal function of the integrated circuit on the wafer. Semiconductor packaged components are usually transported on trays after packaging. However, tube handlers are often used for testing during testing operations. Therefore, semiconductor packaged components must first be converted from trays to tubes. (tube) to facilitate the test operation; in addition, some directly use pallets for testing, but need to use tubes for shipment when shipping. In traditional testing operations, when semiconductor components must be transferred from tray ...

AI Technical Summary

Problems solved by technology

Semiconductor packaged components are usually transported on trays after packaging. However, tube handlers are often used for testing during testing operations. Therefore, semiconductor packaged components must first be converted from trays to tubes. (tube) to facilitate the test operation; in addition, some directly use pallets for testing, but need to use tubes for shipment when shipping

In traditional testing operations, when semiconductor components must be transferred from pallet containers to tubes, if the conversion is done manually, it not only requires a lot of manpower and is slow, but also easily damages the semiconductor components

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