Manufacturing method of circuit board encapsulated by accumulation circuit

Abstract

A kind of circuit board producing method which is applied to circuit enclosing, before the printed circuit board is etched, the surface of line is processed, metal layer which fulfills circuit board producing (COB) is plated; high-low current effect generated by area when wiring can be avoided, and phenomenon that difference of metal layer of circuit board producing (COB) is too big can be avoided; beside, surface of circuit board producing (COB) does not need wire, so area of wiring during design can be increased.

Description

technical field [0001] The invention provides a circuit board manufacturing method applied to integrated circuit packaging, especially an integrated circuit packaging process that can reduce costs. technical background [0002] Manufacturing methods of traditional printed circuit boards, including positive film process and negative film process; [0003] The manufacturing process of the traditional positive film is shown in Figure 3, and its steps include: [0004] X1: chemical through hole: make a chemical through hole (PTH) on the copper circuit board to make the upper and lower copper surfaces conductive; [0005] X2: Circuit production: use liquid ink or photosensitive ink to form circuits through the film and light source exposure principle, and then chemically remove the non-circuit surface ink to expose the copper layer on the surface; [0006] X3: Circuit etching: use the principle of chemical corrosion to decompose the exposed copper layer to completely remove the...

AI Technical Summary

Problems solved by technology

[0020] The positive film process steps include chemical through-holes, circuit fabrication, circuit etching and circuit surface treatment: However, since the circuit etching will form two copper surfaces with different surface areas, it is easy to form a coating after the (COB) surface coating process. Uneven thickness, and in the molding and sealing process of integrated circuit packaging (COB), it is easy to cause mold overflow due to unevenness; moreover, only a part of the required circuit is left, and the integrated circuit packaging (COB) COB) When the process design of wire drawing is required, the wiring area will be limited

[0021] In addition, the negative film manufacturing steps include: chemical through hole, circuit making, circuit protection, circuit etching and circuit surface treatment: however, since negative film manufacturing requires an additional step of circuit protection, and after tin plating, a tin stripping process is also required steps, so the manufacturing cost is higher

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