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Lighting device

A technology for light-emitting devices and light-emitting components, applied in electrical components, electric solid-state devices, circuits, etc., can solve the problems of affecting heat dissipation efficiency, difficult heat dissipation, temperature rise, etc., to avoid product reliability and avoid the use of thermally conductive adhesives , Enhance the effect of heat dissipation

Inactive Publication Date: 2007-11-28
DELTA ELECTRONICS INC
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] With the development of high efficiency and high brightness of the light-emitting device 1, the light-emitting element 12 will dissipate heat during operation, and the accumulated heat will increase the temperature and cause adverse effects on the luminous efficiency and service life of the light-emitting element 12
However, the conventional light-emitting element 12 is disposed on the insulating layer 11 with poor heat dissipation, and the airtight packaging of the encapsulation layer 14 makes it difficult for the heat emitted by the light-emitting element 12 to dissipate, so the problem of difficult heat dissipation becomes more obvious.
[0005] In order to solve the problem of heat dissipation, the conventional technology uses high thermal conductivity materials such as ceramic materials, copper, copper alloy or high thermal conductivity materials to form the substrate 10, and the insulating layer 11 is generally connected to the substrate 10 with a thermally conductive adhesive. However, due to thermal conductivity The heat conduction efficiency of the glue material is not good, so the heat dissipation performance will still be affected due to the problem of thermal resistance, and the deterioration of the glue material will also affect the life of the light emitting device 1

Method used

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Embodiment Construction

[0031] A light emitting device according to a preferred embodiment of the present invention will be described below with reference to related drawings, wherein the same elements will be described with the same reference symbols.

[0032] Referring to FIG. 2 , a light emitting device 2 according to the first embodiment of the present invention includes a substrate 20 , a first metal layer 21 , an insulating layer 22 and at least one light emitting element 23 .

[0033] In this embodiment, the substrate 20 can be a rigid substrate or a flexible substrate, and the material of the substrate 20 can be made of a material with good thermal conductivity, such as copper or copper alloy, but not limited thereto, since the volume of the substrate 20 is substantially larger than that of the first metal layer 21 and the light emitting element 23 , the substrate 20 can also produce a better heat dissipation effect.

[0034] The first metal layer 21 is disposed on the substrate 20. In this e...

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Abstract

The invention discloses a luminous device, which comprises the following parts: base, first metal layer, at least one luminous element and insulating layer, wherein the first metal layer lies on the base; the insulating layer is set on the first metal layer with luminous element on the insulating layer.

Description

technical field [0001] The invention relates to a light emitting device, in particular to a light emitting device with good heat dissipation performance. Background technique [0002] With the development of the optoelectronic industry, light-emitting elements such as light-emitting diodes (LEDs) have been widely used in display applications of various electronic products. [0003] Please refer to FIG. 1, a conventional LED light emitting device 1 is provided with an insulating layer 11 on a substrate 10, and a plurality of LED light emitting elements 12 are arranged on the insulating layer 11, and then connected to the set by wire bonding. A metal layer 13 on the insulating layer 11 forms an electrical connection, and finally the LED light-emitting elements 12 are covered with an encapsulation layer 14 to protect the light-emitting elements 12 from being damaged by mechanical, heat, moisture or other factors. [0004] With the development of high efficiency and high bright...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L23/373
CPCH01L2924/0002H01L2224/48091
Inventor 张绍雄张朝森
Owner DELTA ELECTRONICS INC
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