Method for preparing three dimension stereo sandwiched carrier composite plate
A three-dimensional, composite board technology, applied in the field of composite boards, can solve the problems of easy delamination of composite boards, achieve uniform resin infiltration, save raw material consumption, and stabilize resin content
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0015] The present invention will be further described in detail with reference to the accompanying drawings and embodiments.
[0016] The invention is a method for preparing a three-dimensional sandwich load-bearing composite plate, which has the following preparation steps:
[0017] In the first step, select a lightweight core material 1 with a thickness of 8 to 40 mm, and lay a lower panel inner layer 4 with a thickness of 0.1 to 5.0 mm under the lightweight core material 1. A 0.1-5.0 mm thick upper panel inner layer 2 is laid on the top to form a pre-woven body;
[0018] In the second step, the three-dimensional weaving process is used to weave the load-bearing column 6 in the thickness direction of the pre-braided body formed in the first step to form a three-dimensional sandwich structure;
[0019] In the third step, a 0.1-5.0mm thick upper panel outer layer 3 is laid on the top of the three-dimensional sandwich structure formed in the second step, and a 0.1-5.0mm thick...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com