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LED module

A technology of light-emitting diodes and modules, applied in the direction of electrical components, electric solid-state devices, circuits, etc., can solve the problem of reducing the space of light-emitting diode modules, achieve the best combination shape adaptability, make full use of the space structure, and the effect of thin volume

Inactive Publication Date: 2007-07-18
EVERLIGHT ELECTRONICS
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0009] Another object of the present invention is to provide a thin light-emitting diode module. The technical problem to be solved is to use a flexible substrate with a thickness of less than 0.3 millimeters (mm) and combine light-emitting diodes and packaging materials. Finally, a light-emitting diode module with a module thickness of less than 0.6mm is formed, which reduces the space occupied by the light-emitting diode module and is more suitable for practical use.

Method used

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Embodiment Construction

[0040] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation, structure, characteristics and effects of the light-emitting diode module proposed according to the present invention will be described below in conjunction with the accompanying drawings and preferred embodiments. , as detailed below.

[0041] Please refer to FIG. 1 , which shows a schematic cross-sectional view of a light emitting diode module according to a preferred embodiment of the present invention. The LED module 100 includes a substrate 110 , a LED 120 and an encapsulation layer 130 .

[0042]The substrate 110 is the base of the LED module 100 for carrying other components. The material of the substrate 110 has insulating properties, so a circuit can be fabricated on the substrate 110, and the circuit includes a eutectic metal 111, which can be used to electrically connect with other components in a...

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Abstract

The invention relates to a light-emitting diode module, which includes a substrate, a LED and a packaging layer. The LED and the packaging layer are set on the substrate, and the packaging layer covers and fixes the LED on the substrate to directly form a LED module after the combination of the substrate and the LED.

Description

technical field [0001] The invention relates to a light emitting diode module, in particular to a flexible light emitting diode module. Background technique [0002] In the current light emitting diode (LED: light emitting diode) module manufacturing process, it is necessary to package the light emitting diode first, and then use surface mount technology (SMT: surface mount technology) to weld the positive and negative electrodes of the light emitting diode on the substrate to form a The electrical path produces the LED module, where the substrate is usually a printed circuit board (PCB; printed circuit board). The printed circuit board can be divided into rigid and flexible printed circuit boards. Generally, the rigid printed circuit board used in LED modules is usually flat and has a considerable thickness (thicker than the flexible printed circuit board). Therefore, this type of LED module It will take up a considerable volume when combined. If it is to be applied to ele...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L25/075H01L23/488H01L23/28H01L33/54
CPCH01L2224/11
Inventor 孙国城
Owner EVERLIGHT ELECTRONICS
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