Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Manufacturing method of tunable semiconductor laser and tunable semiconductor laser

A production method and laser technology, which are applied in the direction of semiconductor lasers, optical waveguide semiconductor structures, lasers, etc., can solve the problems of large differences in laser production technology and the impact of laser performance, etc., to reduce the number of device growth times, shorten the research and development cycle, uniform good sex effect

Active Publication Date: 2009-09-30
GUANGXUN SCI & TECH WUHAN
View PDF8 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Würzburg University and Max Planck Research Center in Germany reported DFB lasers for making vertical gratings in IEEE PHOTONICS TECHNOLOGY LETTERS, VOL.19, NO.5, P.264 in 2007, but they used dotted line quantum well technology, which is different from current practical lasers. Production techniques vary widely
And the grating is etched through the active area, and the lateral damage caused by the etching will also affect the performance of the laser
At present, vertical gratings are still only used in DFB lasers, and there are no related reports on DBR and SGDBR lasers.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing method of tunable semiconductor laser and tunable semiconductor laser
  • Manufacturing method of tunable semiconductor laser and tunable semiconductor laser
  • Manufacturing method of tunable semiconductor laser and tunable semiconductor laser

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0041] The manufacturing method of the semiconductor laser and the semiconductor laser of the present invention will be described in detail below with reference to the accompanying drawings and embodiments.

[0042] The manufacturing method of the tunable semiconductor laser of the present invention includes the following process steps (in combination with a two-stage DBR):

[0043] 1) as image 3 As shown, epitaxial growth is performed on an n-type indium phosphide (InP) substrate 5, and the epitaxial layer structure from bottom to top is a lower waveguide layer 6, a multiple quantum well structure 7, an upper waveguide layer 8, an indium phosphide layer (InP )9;

[0044] 2) as Figure 4 As shown, the silicon dioxide dielectric film 10 is grown on the epitaxial layer by using a plasma enhanced chemical vapor deposition system (PECVD);

[0045] 3) as Figure 5 As shown in the figure, the active waveguide region and the grating region (grating region) are divided into the a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Provided is a making method of a tunable semiconductor laser and a tunable semiconductor laser, wherein the making method comprises the following procedures: growing lower waveguide layer, multiple quantum trap structure, upper waveguide layer and indium phosphide layer epitaxially and sequentially on the n type substrate; growing earth silicon dielectric membrane on the epitaxial layer; dividing into active waveguide region and raster region; butting passive waveguide portion; removing earth silicon dielectric membrane and indium phosphide layer on the surface of the active waveguide region; growing ridge waveguide indium phosphide material and low resistivity InGaAs ternary layer sequentially; growing earth silicon dielectric membrane; making raster graphic of the ridge waveguide and the ridge waveguide on the raster region; etching raster of the ridge waveguide and the ridge waveguide on the raster region; growing earth silicon dielectric membrane continuously; opening the window separately on active waveguide region and raster region in order to make electrode isolation ditch; making P face and N face electrode of laser. The product of the invention has good product property and high automation degree of the product making, which simplifies the technology process and has good product ratio.

Description

technical field [0001] The present invention relates to a semiconductor laser for communication. In particular, it relates to a method for manufacturing a tunable semiconductor laser with distributed Bragg reflection and sampling grating distributed Bragg reflection with high performance and high degree of automation, and a tunable semiconductor laser thereof. Background technique [0002] At present, there are many technologies for tunable lasers, mainly vertical cavity surface emitting laser (VCSEL), external cavity tuning technology, distributed feedback Bragg laser (DFB) array technology, distributed Bragg reflection laser (DBR) and sampling grating distributed Bragg reflection Laser (SGDBR) technology, etc. Among them, the output power of VCSEL is low, and due to the limitation of material properties, it is difficult to develop in the long wavelength range (1310 to 1550 nm); the external cavity tuning wavelength conversion speed is slow, and the wavelength is tuned by ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01S5/12H01S5/125H01S5/10H01S5/22H01S5/34
Inventor 董雷张瑞康
Owner GUANGXUN SCI & TECH WUHAN
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products