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Resistance crosspoint storage array with charge injection differential read-out amplifier

A memory cell array and cross-point technology, which is applied in the field of resistive cross-point memory cell arrays, can solve difficult problems and achieve the effects of reduced surface area, clearer and easier identification, and good common-mode noise suppression

Inactive Publication Date: 2009-04-29
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, equipotential isolation is often difficult to implement in large arrays
Autoscale and triple sample read techniques have been used to read data in large MRAM arrays using equipotential isolation techniques, but these readout processes typically limit the readout time to a few microseconds

Method used

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  • Resistance crosspoint storage array with charge injection differential read-out amplifier
  • Resistance crosspoint storage array with charge injection differential read-out amplifier
  • Resistance crosspoint storage array with charge injection differential read-out amplifier

Examples

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Embodiment Construction

[0024] In the following description, the same reference numerals designate the same elements. Furthermore, the drawings are intended to graphically present key features of example embodiments. The drawings are not intended to illustrate every feature of actual embodiments nor to depict relative dimensions of the depicted elements, nor are they drawn to scale.

[0025] refer to figure 1 , in one embodiment, the data storage device 8 includes a resistive cross-point memory cell array 10, a plurality of word lines 14 extending along rows of the cross-point memory cell array 12, and a plurality of word lines 14 extending along a row of the cross-point memory cell array 12. A plurality of bit lines 16 are stretched. Memory cells 12 of memory cell array 10 may be implemented with any of a very wide variety of conventional resistive memory elements, including magnetic random access memory (MRAM) elements, phase change memory elements, and write-once (e.g., fuse-based or antifuse) ...

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PUM

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Abstract

A data storage device (8) is disclosed comprising an array (10) of resistive cross-point memory cells (12), a plurality of word lines (14), a plurality of bit lines (16) and an injection charge amplifier (30) The sense amplifier (24). The storage units (12) are arranged in groups (15) of one or more storage units. The injected charge amplifier (30) determines whether the sensed memory cell is in the first or second resistance state by comparing with a reference cell.

Description

technical field [0001] The present invention relates generally to resistive cross point memory cell arrays, and more particularly, the present invention relates to resistive cross point memory cell arrays with differential sense amplifiers using a charge injection mode. Background technique [0002] Many arrays of resistive cross-point memory cells have been proposed, including those with magnetic random access memory (MRAM) elements, phase-change memory elements, polysilicon memory Array of resistive cross-point memory cells for storage elements. [0003] A typical MRAM memory device includes, for example, an array of memory cells. Word lines may extend along rows of memory cells and bit lines may extend along columns of memory cells. Each memory cell is located at the intersection of a word line and a bit line. Each MRAM memory cell stores information bits in the form of magnetization direction. Specifically, the magnetization of each memory cell exhibits one of two st...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G11C7/06G11C11/15G11C13/00G11C11/16G11C16/28
CPCG11C11/16G11C16/28G11C7/062G11C7/067G11C11/1673G11C11/1693G11C13/004G11C13/0061G11C17/18G11C2013/0054G11C2213/72G11C2213/77G11C2213/78G11C11/15
Inventor L·T·特兰F·A·佩尔纳
Owner SAMSUNG ELECTRONICS CO LTD
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