Shielded embedded electronic component substrate fabrication method and structure

Abstract

A shielded embedded electronic component substrate includes a core dielectric layer having a die opening. An electrically conductive die shield lines the die opening. An electronic component is mounted within the die opening and to the die shield, where the die shield shields the electronic component. By mounting the electronic component within the die opening, the shielded embedded electronic component substrate is made relatively thin. Further, heat generated by the electronic component is dissipated to the die shield and to the ambient environment. Accordingly, the shielded embedded electronic component substrate is well suited for use when the electronic component generates a significant amount of heat, e.g., in high power applications.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates generally to methods of fabricating electronic component substrates and the resulting structures. More particularly, the present invention relates to methods of fabricating a shielded embedded electronic component substrate and the resulting structures.[0003]2. Description of the Related Art[0004]To reduce overall package thickness, an electronic component is placed inside of an opening in a substrate. By placing the electronic component inside of the opening in the substrate, the resulting electronic component package is thin relative to an electronic component package having the electronic component mounted on top of the substrate.[0005]Unfortunately, mounting the electronic component inside of the substrate causes electromagnetic interference between the electronic component and the substrate circuit patterns due to the close proximity of the electronic component to the substrate circuit...

AI Technical Summary

Benefits of technology

This patent describes a way to make a thin electronic component that is shielded from heat. The way it is done is by adding a layer of electrically conductive material around the component and dissipating the heat it generates through the shield. This makes it suitable for high power applications where the component would generate a lot of heat.

Problems solved by technology

Unfortunately, mounting the electronic component inside of the substrate causes electromagnetic interference between the electronic component and the substrate circuit patterns due to the close proximity of the electronic component to the substrate circuit patterns.

Further, as the electronic component is embedded inside of the substrate, which is typically a poor thermal conductor, heat transfer from the electronic component is problematic.

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