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Reflective mask cleaning apparatus and reflective mask cleaning method

a technology of reflective masks and cleaning methods, which is applied in the direction of cleaning processes and apparatus, photomechanical treatment, instruments, etc., can solve the problems of ruthenium oxide formation in the exposed portion, decrease in reflectance, and inability to clean the exposed portion, etc., to achieve the effect of suppressing the degradation of optical characteristics

Inactive Publication Date: 2017-01-19
SHIBAURA MECHATRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent text describes a cleaning apparatus and method that can protect the ruthenium-containing capping layer in a reflective mask. This helps to prevent the degradation of the optical properties of the layer, which is important for maintaining the quality of the mask.

Problems solved by technology

However, in the case where the capping layer is formed from ruthenium, such cleaning oxidizes ruthenium into ruthenium oxide.
The formation of ruthenium oxide causes the problem of decreasing the reflectance.
Thus, ruthenium oxide is formed in the exposed portion and decreases the reflectance.
This causes the problem of degrading the optical characteristics of the reflective mask.

Method used

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  • Reflective mask cleaning apparatus and reflective mask cleaning method
  • Reflective mask cleaning apparatus and reflective mask cleaning method
  • Reflective mask cleaning apparatus and reflective mask cleaning method

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Embodiment Construction

[0025]Embodiments will now be illustrated with reference to the drawings. In the drawings, similar components are labeled with like reference numerals, and the detailed description thereof is omitted appropriately.

[0026]The to-be-cleaned object W can be configured so that a layer containing an oxidizable material is exposed.

[0027]The to-be-cleaned object W can be e.g. a reflective mask including a ruthenium-containing capping layer or a substrate including a ruthenium-containing capping layer (a substrate under the process for manufacturing a reflective mask).

[0028]FIG. 1 is a schematic sectional view for illustrating a reflective mask 210 serving as a to-be-cleaned object W.

[0029]As shown in FIG. 1, on one major surface of a substrate 201, a reflection layer 202, a capping layer 203, and an absorption layer 204 are stacked in this order.

[0030]A conductive layer 205 is formed on the other major surface of the substrate 201.

[0031]The substrate 201 is formed from e.g. a low thermal ex...

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PUM

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Abstract

A reflective mask cleaning apparatus according to an embodiment comprises a first supply section configured to supply a first solution containing at least one of an organic solvent and a surfactant to a ruthenium-containing capping layer provided in a reflective mask; and a second supply section configured to supply at least one of a reducing solution and an oxygen-free solution to the capping layer.A reflective mask cleaning apparatus according to an alternative embodiment comprises a third supply section configured to supply a plasma product produced from a reducing gas to a ruthenium-containing capping layer provided in a reflective mask; and a second supply section configured to supply at least one of a reducing solution and an oxygen-free solution to the capping layer.

Description

TECHNICAL FIELD[0001]Embodiments of the invention relates to a reflective mask cleaning apparatus and a reflective mask cleaning method.BACKGROUND ART[0002]There is known a member including a layer containing an oxidizable material such as ruthenium (Ru).[0003]For instance, a reflective mask is used in EUV lithography technique for transferring a fine pattern using extreme ultraviolet (EUV) radiation. The reflective mask includes a capping layer (also referred to as e.g. stopper layer) containing ruthenium.[0004]In manufacturing this reflective mask, a reflection layer, a capping layer, and an absorption layer are sequentially formed on a major surface of a substrate. The absorption layer is dry etched to form a pattern region having a desired pattern. Then, the absorption layer, the capping layer, and the reflection layer are dry etched to form a light shielding region (also referred to as e.g. light shielding frame) surrounding the pattern region.[0005]Here, a resist mask is used ...

Claims

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Application Information

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IPC IPC(8): G03F1/82B08B7/00G03F1/24
CPCG03F1/82B08B7/0035G03F1/24G03F7/70925G03F7/422G03F7/0045
Inventor MATSUSHIMA, DAISUKEDEMURA, KENSUKESUZUKI, MASAFUMINAKAMURA, SATOSHI
Owner SHIBAURA MECHATRONICS CORP
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