Heat-conducting assembly

Abstract

A heat-conducting assembly is mounted between a heat-generating element and a heat-dissipating plate. The heat-conducting assembly includes a base, a first heat-conducting block, a second heat-conducting block and an elastic element. The base is attached on the heat-generating element. The first heat-conducting block is provided on the base. The first heat-conducting block has a first slope and a fixing groove. The second heat-conducting block abuts on the heat-dissipating plate. The second heat-conducting block has a second slope and a locking groove. The second slope is slidingly disposed on the first slope. The elastic element has a fixed end and a buckling end formed on one side of the fixed end. The fixed end is fixed in the fixing groove, and the buckling end is buckled into the locking groove. Via this arrangement, the heat-conducting efficiency of the heat-conducting assembly of the present invention can be improved.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a heat-conducting assembly, and in particular to a heat-conducting assembly that is applicable to electronic products.[0003]2. Description of Prior Art[0004]With the development of science and technology, electronic products and electronic elements are made more and more compact with a light weight. Accordingly, heat dissipation of an electronic product or electronic element becomes an important issue. Insufficient heat dissipation not only affects the operation of the electronic product or the electronic element, but also affects its lifetime. Thus, it is an important issue for those skilled in this field to improve the heat dissipation.[0005]A common electronic product, such as an industrial computer, is provided therein with a heat-generating element, a heat-dissipating plate and a heat-conducting assembly. The heat-conducting assembly is located between the heat-generating element an...

AI Technical Summary

Benefits of technology

[0008]The present invention is to provide a heat-conducting assembly. With a first heat-conducting block, a second heat-conducting block and an elastic element, the total height of the first and second heat-conducting blocks can be adjusted freely between a heat-generating element and a heat-dissipating plate, so that the first and second heat-conducting blocks can abut tightly the heat-generating element and the heat-dissipating plate respectively. Via this arrangement, the heat generated by the heat-generating element can be conducted to the heat-dissipating plate efficiently, thereby increasing the heat-conducting efficiency of the heat-conducting assembly.

[0011]Therefore, via the heat-conducting assembly of the present invention, the poor contact of the heat-conducting block in prior art caused by the tolerance of pitch between the heat-generating element and the heat-dissipating plate and in turn the deterioration of heat-conducting efficiency of the heat-conducting block can be avoided. Thus, the present invention indeed improves the heat-conducting efficiency and has industrial applicability.

Problems solved by technology

Accordingly, heat dissipation of an electronic product or electronic element becomes an important issue.

Insufficient heat dissipation not only affects the operation of the electronic product or the electronic element, but also affects its lifetime.

Thus, it is an important issue for those skilled in this field to improve the heat dissipation.

However, in manufacturing, a slight tolerance may be inevitably generated between individual electronic products.

Thus, the heat-conducting block cannot be adjusted finely to compensate for the slight tolerance of pitch.

As a result, if the heat-conducting block is larger than the pitch, it cannot be used.

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