Cooling device with ringed fins
a cooling device and fin technology, applied in semiconductor devices, semiconductor/solid-state device details, lighting and heating apparatus, etc., can solve the problems of insufficient contact area between the condensing part of the heat pipe and the cooling structure, inability to completely develop the heat-transferring effect of individual heat pipes, and inability to transfer heat, etc., to achieve the effect of promoting the heat-transferring
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[0018]In cooperation with attached drawings, the technical contents and detailed description of the present invention are described thereinafter according to a number of preferable embodiments, being not used to limit its executing scope. Any equivalent variation and modification made according to appended claims is all covered by the claims claimed by the present invention.
[0019]Please refer to FIG. 1 and FIG. 2, which respectively are a perspective explosive view and a perspective assembled view of the present invention. The invention is to provide a cooling device with ringed fins, which includes a heat-conducting base 1, at least two fin sets 2, and at least one heat pipe 3.
[0020]According to a preferable embodiment of the invention, the heat-conducting base 1 is made of materials with excellent heat conductivity, such as aluminum and copper. Its bottom face 10 is contacted closely with an electronic element 4, such as CPU, as shown in FIG. 4. A cooler 12 may be further arranged...
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