Heat dissipating system and method
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[0020]Before the present invention is described in greater detail, it should be noted that the same reference numerals have been used to denote like elements throughout the specification.
[0021]Referring to FIGS. 2 to 5, the first preferred embodiment of a heat dissipating system according to the present invention is installed in a computer module 3. The computer module 3 has a housing 33 defining upper and lower chambers 31, 32, a mounting board 34 fixed inside the lower chamber 32, and a plurality of module chips 35 mounted on the mounting board 34. The heat dissipating system of the present invention comprises a condenser 4, a heat-absorbing unit 5, and a tubing unit 6. The module chips 35 are heat sources to undergo heat dissipation by the system of the present invention. The condenser 4 is disposed in the upper chamber 31 of the computer module 3, and includes a vapor-receiving part 411 formed on a top end thereof, an inlet 414 connected fluidly to the vapor-receiving part 411, ...
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