Computer rack with power distribution system

Abstract

The invention relates to a computer rack, frame or system having a direct current power supply positioned at the upper portion of the rack. In one variation, the DC power supply is placed in the highest shelf in the computer rack. In another variation, the DC power supply is placed on top of the computer rack. In yet another variation, a dual column computer rack with a back-to-back configuration is implemented with DC power supplies placed in a top shelf of the one of the computer columns. The DC power supply may comprise of one or more direct current power supply modules configured to provide fail over protection. In another aspect of the invention, the power supply modules are placed in a separate rack and provide direct current to support computers in one or more computer racks.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application is claiming the benefit of priority to U.S. provisional application Ser. No. ______ entitled “COMPUTER RACK WITH POWER DISTRIBUTION SYSTEM” (Attorney Docket No. 44345-30010.00) filed May 16, 2003, which is incorporated herein by reference in its entirety.FIELD OF THE INVENTION [0002] This invention relates to the manner in which computers are configured and provided in a given area in order to conserve space and deal with cooling issues associated with housing a large number of computers. Aspects of the invention assist with increasing the density at which computers may be provided, particularly in a network server or host environment. In particular, a power supply unit for supporting the electrical needs of the various computers in a computer rack may be utilized to improve heat dissipation of a multi-computer system house in the computer rack. BACKGROUND OF THE INVENTION [0003] As information technology has rapidly pr...

AI Technical Summary

Benefits of technology

This configuration enhances the thermal management of computer clusters, allows for higher computer density, and reduces space requirements, enabling more efficient use of server farm space and cost-effective expansion.

Problems solved by technology

Many of the racks are filled with cumbersome computers mounted on sliders which are attached through mounting holes provided in the front and back of the rack.

It is this latter design aspect which not only results in inefficiency in the amount of access space required, but also in the frequent inefficiencies associated with having to administer services to both sides of a computer.

Furthermore, in some existing server farm facilities, there is no more space available for scaleable growth.

However, as one increases the density of computers, problems associated with heat dissipation rises exponentially.

One of the major causes of electronic component failure is overheating.

High performance electronics such as CPUs generate substantial amounts of heat.

Additionally, next generation processors are emitting substantially more heat as computing requirements increases.

Thereby placing further demands on effective heat dissipation.

Power supplies also generate a significant amount of heat relative to the other electronic components in a computing unit, the traditional configurations of having power supplies distributed throughout every computing unit in the computer rack has many drawbacks in management of thermal levels at the individual computer node level as well as cluster level.

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