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Foreign matter removing apparatus

a foreign matter and apparatus technology, applied in the direction of chemistry apparatus and processes, cleaning equipments, printed circuit manufacture, etc., can solve the problems of foreign matter not being removed sufficiently, mounted parts become bumps, and the printed board unit itself is destroyed, so as to facilitate the intensity of shock received and effectively remove foreign matter

Inactive Publication Date: 2006-12-28
FUJITSU LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0016] The present invention has been accomplished in view of the above circumstances, and provides a foreign matter removing apparatus capable of effectively removing foreign matter existing on a mounting surface of a printed board unit.

Problems solved by technology

In the case of a printed board unit having a surface on which parts are mounted, however, the mounted parts become bumps when foreign matter is removed.
Thus, in the case of the methods disclosed in the documents described above, foreign matter can not be removed sufficiently, and a foreign matter removing apparatus suitable for the printed board unit is desired.
According to the foreign matter removing method using such shock wave, excessive shock exceeding shock resistance is applied to the printed board unit and there is a danger that the printed board unit itself is destroyed, and there is a problem that defectives are frequently produced in a screening stage during which latent failure of the printed board unit such as production failure and element failure of the printed board unit is removed.

Method used

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second embodiment

[0069] Next, the invention will be explained.

[0070]FIG. 4 illustrates a schematic diagram (a) showing the second embodiment of the foreign matter removing apparatus of the invention, and an enlarged view (b) of collected foreign matter.

[0071] As shown in part (a) of FIG. 4, the foreign matter removing apparatus 2 of the second embodiment includes a blowout fan unit 21 provided above the printed board unit 10 for blowing gas toward the printed board unit 10, and a vacuum unit 22 provided below the printed board unit 10 for sucking gas from the printed board unit 10. Foreign matter dropped by vibration is forcibly removed from the printed board unit 10 by the blowout fan unit 21 and the vacuum unit 22.

[0072] According to the second embodiment, the vacuum unit 22 is provided with a filter 23 for collecting foreign matter included in gas sucked by the vacuum unit 22, and the filter 23 can collect the dropped foreign matter 24 (see part (b) of FIG. 4). If the foreign matter 24 collecte...

third embodiment

[0074] Next, the invention will be explained.

[0075]FIG. 5 illustrates a schematic diagram (a) showing a foreign matter removing apparatus of the third embodiment, and a partial enlarged view (b) thereof.

[0076] As shown in part (a) of FIG. 5, the holder 14 of the foreign matter removing apparatus 3 can hold the printed board unit 10 with any angle. As shown in part (b) of FIG. 5, continuous shock wave generated by the electromagnetic vibrator 15 is transmitted to the printed board unit 10 in a state in which the mounting surface 11 is held downwardly.

[0077] With this structure, as shown in part (c) of FIG. 5, the foreign matter 31 entered into a connector 30 mounted on the printed board unit 10 can effectively drop downward.

fourth embodiment

[0078] Next, the invention will be explained.

[0079]FIG. 6 shows an outline of a foreign matter removing apparatus of a fourth embodiment, and FIG. 7 is a graph showing a shock value monitoring result by the foreign matter removing apparatus shown in FIG. 6.

[0080] As shown in parts (a) and (b) of FIG. 6, the foreign matter removing apparatus 4 includes G sensors 40 which measure the intensity of shock received by various portions of the printed board unit 10 by continuous shock wave, a monitoring unit 41 which monitors shock values measured by the G sensors 40, cables 42 which transmit measuring signals from the G sensors 40 to the monitoring unit 41, and a display unit 43 which displays a monitoring result on a screen.

[0081] As shown in FIG. 7, acceleration G (intensity of shock) received by the various portions (CH1, CH2, CH3, . . . ) of the printed board unit 10 from the G sensors 40 and the monitoring unit 41 is displayed on the display unit 43. With this, it is possible to eas...

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PUM

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Abstract

A foreign matter removing apparatus which removes foreign matter existing on a mounting surface of a printed board unit. The foreign matter removing apparatus includes a holder which holds the printed board unit in its desired attitude, an electromagnetic vibrator which generates continuous shock wave having repeated waveform, and a transmitting plate which transmits the continuous shock wave generated by the shock wave generator to the printed board unit held by the holder.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a foreign matter removing apparatus for removing foreign matter on a mounting surface of a printed board unit. [0003] 2. Description of the Related Art [0004] Conventionally, various methods for removing foreign matter such as dust attached to an electronic device by means of vibration are devised. For example, there is disclosed a dust removing method (see Japanese Patent Application Laid-open No.58-61543 (pages 1 to 2, FIG. 7) for example) in which an inclination angle of a cathode-ray tube is variously changed while vibrating an outer wall of a cathode-ray tube by a vibration generator, thereby removing foreign matter existing in a gap of obstruction such as a shadow mask in the cathode-ray tube. [0005] There is also disclosed a wafer chuck (see Japanese Patent Application Laid-open No. 2000-195930 (pages 1 to 3, FIG. 1) for example) in which a chuck itself has a function for clea...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): A47L5/14
CPCB08B7/02H05K3/26H05K2203/082H05K2203/0292H05K2203/081H05K2203/0165H01L2224/16225
Inventor SUEHIRO, MITSUO
Owner FUJITSU LTD
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