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Method for fabricating an enlarged fluid chamber

a technology of fluid chamber and fluid injection, which is applied in the direction of printing, etc., can solve the problems of hydraulic crosstalk and difficult droplet volume control, and achieve the effect of improving printing resolution

Inactive Publication Date: 2005-07-21
BENQ CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0009] Another object of the present invention is to provide multiple steps of removing and etching multiple sacrificial layers to create a neck between a chamber and a fluid channel stabilizing the ejected fluid.
[0010] Another object of the present invention is to provide multiple steps of removing and etching the multiple sacrificial layers to form different size chambers, thereby ejecting droplets with different sizes and improving printing resolution.
[0016] The present invention improves on the related art in that a chamber neck is formed between a fluid chamber and a fluid channel using different sacrificial layers with different etching rates. The chamber neck can stabilize ejection of the fluid droplet. Additionally, a single print-head chip with different chamber sizes can also be formed, thereby ejecting droplets with different sizes and improving printing resolution.

Problems solved by technology

As a result, the pressure generated from the firing chamber can affect the meniscus at the nozzles of its neighboring chambers, posing hydraulic crosstalk.
Hydraulic crosstalk makes droplet volume control difficult and even causes unexpected droplet ejection when combined with thermal crosstalk.

Method used

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  • Method for fabricating an enlarged fluid chamber
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  • Method for fabricating an enlarged fluid chamber

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Experimental program
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first embodiment

[0023]FIGS. 3A-3E are schematic views of a method for manufacturing a fluid injector in accordance with a first embodiment of the present invention using multiple sacrificial layers with different etching rates to create a chamber neck between an enlarged fluid chamber and a fluid channel. The chamber neck can stabilize ejection of the fluid droplet.

[0024] Referring to FIG. 3A, a substrate 100, such as a single crystal silicon wafer, having a first surface 1001 and a second surface 1002 is provided. A patterned first sacrificial layer 110a is formed on the first surface 1101 of the silicon substrate 100. A patterned second sacrificial layer 110b is then formed overlying the first surface 1101 of the silicon substrate 100 covering the first sacrificial layer 110a. The first sacrificial layer 110a is formed at both sides of the fluid channel with a thickness less than the second sacrificial layer 110b. The first sacrificial layer 110a comprises chemical vapor deposition of silicon ni...

second embodiment

[0034]FIGS. 4A-4E are schematic views of a method for manufacturing a fluid injector in accordance with a second embodiment of the present invention using multiple sacrificial layers with different etching rates to create a slant adjacent to the fluid channel to impede backfill of the fluid and prevent perturbation in neighboring chambers, thereby stabilizing ejection of the fluid droplet.

[0035] Referring to FIG. 4A, a substrate 100, such as a single crystal silicon wafer, having a first surface 1001 and a second surface 1002 is provided. A patterned first sacrificial layer 110a is formed on the first surface 1101 of the silicon substrate 100. The first sacrificial layer 110c is formed at one side of the fluid channel and patterned into a plurality of areas with increasing width and gaps. A patterned second sacrificial layer 110b is then formed overlying the first surface 1101 of the silicon substrate 100 covering the first sacrificial layer 110c. The thickness of the first sacrifi...

third embodiment

[0044]FIGS. 5A-5E are schematic views of a method for manufacturing a fluid injector in accordance with a third embodiment of the present invention using multiple sacrificial layers with different etching rates to create a single print-head chip with different chamber sizes, thereby ejecting droplets with different sizes and improving printing resolution.

[0045] Referring to FIG. 5A, a substrate 100, such as a single crystal silicon wafer, having a first surface 1001 and a second surface 1002 is provided. A patterned first sacrificial layer 110d is formed on the first surface 1101 of the silicon substrate 100. A patterned second sacrificial layer 110b is then formed overlying the first surface 1101 of the silicon substrate 100 covering the first sacrificial layer 110d. The first sacrificial layer 110d is formed at one side of the fluid channel with a thickness less than the second sacrificial layer 110b. The first sacrificial layer 110d comprises chemical vapor deposition of silicon...

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Abstract

A method for fabricating an enlarged fluid chamber using multiple sacrificial layers. The method comprises providing a plurality of patterned sacrificial layers between a substrate and a structural layer. A chamber neck is formed between a fluid chamber and a fluid channel using different sacrificial layers with different etching rates. The chamber neck can stabilize ejection of the fluid droplet. Additionally, a single print-head chip with different chamber sizes can also be formed, thereby ejecting droplets with different sizes.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a method for manufacturing a fluid injector, and more particularly, to a method for fabricating an enlarged fluid chamber of a fluid injector using multiple sacrificial layers. [0003] 2. Description of the Related Art [0004] Typically, fluid injectors are employed in inkjet printers, fuel injectors, biomedical chips and other devices. Among inkjet printers presently known and used, injection by thermally driven bubbles has been most successful due to its reliability, simplicity and relatively low cost. [0005]FIG. 1 is a conventional monolithic fluid injector 1 as disclosed in U.S. Pat. No. 6,102,530, the entirety of which is hereby incorporated by reference. A structural layer 12 is formed on a silicon substrate 10. A fluid chamber 14 is formed between the silicon substrate 10 and the structural layer 12 to receive fluid 26. A first heater 20 and a second heater 22 are disposed on th...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B41J2/16
CPCB41J2/1603B41J2/1639B41J2/1629
Inventor HU, HUNG-SHENGCHEN, WEI-LINPENG, MING-CHUNG
Owner BENQ CORP
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