Sputtering apparatus and sputter film deposition method

Abstract

A sputtering apparatus and a sputter film deposition method, which includes a conventional magnetron and an AC magnetron for deposition of a low refractive index film, and a conventional magnetron and an AC magnetron for deposition of a high refractive index film, performs film deposition by each of the AC magnetrons until having achieved 90% of a designed film thickness, and then performs the film deposition only by each of the conventional magnetrons, and which can control the film thickness with high precision and have excellent productivity.

Description

TECHNICAL FIELD [0001] The present invention relates to a sputtering apparatus and a sputter film deposition method, which are applicable to a film deposition process for, e.g., an optical filter, in particular, a sputtering apparatus and a sputter film deposition method, which are appropriate for production of a WDM filter for used in a WDM (wavelength Division Multiplexing) technique. BACKGROUND ART [0002] JP-A-3-253568 has disclosed a carousel-type sputtering apparatus for depositing a film on a substrate, such as a glass substrate. The carousel-type sputtering apparatus is a rotary batch-type sputtering apparatus, which is configured so that a substrate holder (rotary drum) formed in a polygonal and cylindrical shape are included in a chamber, and magnetrons with rectangular targets held therein are provided inside the chamber. Film deposition is performed by supplying the magnetrons with power to generate plasma on outer surfaces of the targets while rotating the substrate hold...

AI Technical Summary

Benefits of technology

The present invention provides a carousel-type sputtering apparatus that can control the thickness of films deposited during film deposition. The apparatus includes a drum with substrate holders, magnetron sputtering sources with targets and magnetron units, a film thickness measuring instrument, a power supply unit, and a controller. The controller can adjust various parameters affecting the amount of film deposition based on the measurement results from the film thickness measuring instrument. The apparatus can also use an AC magnetron sputtering source with two adjacent targets to achieve rapid and high precision film deposition. The invention is useful for controlling the film thickness in a time period where slow film deposition is performed only by the magnetron sputtering source with a target mounted on a single magnetron unit. The apparatus can also be used for alternately depositing low refractive index films and high refractive index films by using a combination of magnetron sputtering sources for mounting targets for deposition of different films.

Problems solved by technology

However, the conventional film deposition apparatuses have been difficult to control film thicknesses with high precision.

The conventional film deposition apparatuses have caused a problem that productivity is significantly decreased since the film deposition rate needs to be lowered in order to increase the precision of film thicknesses.

This method is disadvantageous in that productivity is low since film deposition processes and measuring processes are alternately performed and since film deposition is interrupted during measurement.

However, it is not easy to make each of the film thicknesses uniform since it is difficult to equalize the conditions of both cathodes.

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