Apparatus for substrate marking

Abstract

An apparatus for substrate scribing which can apply scribing force vertically on a substrate is provided. The apparatus comprises a line-forming part for scribing a line on the substrate, a pressing part for applying pressure on the line-forming part, an elevator for moving the pressing part up and down, an elevating guiding part for leading the elevator, and a pressing guiding part for leading the pressure part. According to the invention, a scribed line can be formed on the substrate precisely by solving the eccentric force which deviates to the X-Y direction.

Description

[0001] Related Application Cross Reference [0002] This application claims the benefit of Korean Patent Application No. 10-2006-0034973 filed Apr. 18, 2006, the disclosure of which is hereby incorporated by reference in its entirety. technical field [0003] The present invention relates to a device for scribing a substrate, in particular to such a device for scribing a substrate comprising a head for scribing so that the force of the scribing acts perpendicularly on the substrate department. Background technique [0004] Generally, a glass substrate for a display is manufactured in a large size, which is then cut and processed into an appropriate size for use. [0005] The process of cutting a brittle material such as a glass substrate is performed by a scribing process of forming a cutting line on the surface of the glass substrate by a tool composed of a diamond material having a hardness greater than that of the glass substrate; The substrate is a cutting process of c...

AI Technical Summary

Problems solved by technology

Therefore, as shown in FIG. 3, when the wheel 26 travels in a different driving direction, such as the “A” direction or the “B” direction shown in FIG. 1 and W 2 The resulting friction force V 1 and V 2 Generated repulsion X 1 and x 2 , and the repulsion X 1 and x 2 Generates an unplanned momentary force M, making it difficult to form a precise line

[0021] In addition, in the conventional apparatus of Fig. 1 and Fig. 2, since the cylinder driven by air is used to control the supercharging force, it is impossible to control the supercharging force at an extremely low pressure (0.02kgf / cm 2 ) or lower pressure

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