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Multilayer press packet, packet structure and multilayer, tool and press for pressing multilayer

A technology of presses and laminates, applied in the field of plate stack structures and presses, can solve the problems of increasing the production cost of multi-layer boards or printed circuit boards, poor thermal conductivity, and time-consuming, so as to reduce processing costs and energy costs , Shorten production and processing time, improve productivity

Inactive Publication Date: 2007-01-24
M·巴克豪斯
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the poor thermal conductivity of the above materials, on the one hand, it consumes a lot of energy, and on the other hand, it takes time, thus increasing the production cost of the corresponding multi-layer board or printed circuit board

Method used

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  • Multilayer press packet, packet structure and multilayer, tool and press for pressing multilayer
  • Multilayer press packet, packet structure and multilayer, tool and press for pressing multilayer
  • Multilayer press packet, packet structure and multilayer, tool and press for pressing multilayer

Examples

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Embodiment Construction

[0041] Figure 1a and 1b A side view and a perspective view, respectively, of a hitherto prior art laminate stack, wherein in the only partially shown press 2 the insertion opening 3 for inserting the only partially shown multilayer press 2a is shown here The inner plate stack structure 1.

[0042] It can be seen from the figure that the laminated core 1 known from the prior art has two tools 4 and 5 , an upper tool 4 and a lower tool 5 . Arranged between the two tools 4 and 5 are respective multi-layer plates 7 separated from one another by respective partition plates 6 .

[0043] In a press 2 conventionally used in the prior art, the thickness of the upper pressing plate 2 b and the lower pressing plate 2 c is substantially each approximately 40 mm. The tools 4 and 5, which are preferably made of low-grade alloyed steel sheets, essentially have a thickness of approximately 10 mm. Also arranged between the tools 4 and 5 and the respective adjacently arranged partition plates...

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PUM

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Abstract

The invention relates to a tool (11a, 11b, 11c) for pressing a multilayer press packet (1b), particularly for placing inside a press (2), preferably for inserting into the insertion opening (3) of a multiplaten press (2a). The multilayer press packet (1b), in particular, has a number of multilayers (7) that are separated from one another by at least one separating plate (6). Advantages are achieved by virtue of the fact that the tool (11, 11b, 11c) can be electrically heated. To this end, at least one electrically operable heating element (10) is provided.

Description

technical field [0001] The invention relates to a tool for pressing a multilayer laminate stack, which can be arranged in a press, preferably inserted into an insertion opening of the multilayer press, for the pressing process, wherein the multilayer laminate stack has a plurality of at least A divider separates the set of multilayer boards. In addition, the invention also relates to a stack structure for pressing a multilayer laminated stack using said tool. Finally, the invention also relates to a press for pressing or producing multi-layer boards using the above-mentioned tool or using the above-mentioned stack structure. Background technique [0002] Various designs of tools or stacks, in particular multilayer laminate stacks, are known from the prior art for producing multilayer boards, preferably for pressing multilayer printed circuit boards. The multilayer boards (multilayer circuit boards) are usually pressed under vacuum in a multilayer press, in which the indivi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B30B15/00B30B15/34H05K3/46
CPCB32B2457/08C22C21/10Y10T428/12493C22C21/16B30B15/064B32B37/26C22C21/14B30B7/02C22C21/08C22C1/026C22C21/18B32B37/06B30B15/062
Inventor D·巴克豪斯
Owner M·巴克豪斯
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