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Method for determining metal film fatigue life in electro-mechanical coupling field

A metal film, fatigue life technology, used in the application of stable tension/pressure testing material strength, measuring devices, material analysis by electromagnetic means, etc. The contact between the film and the external circuit is unstable, so as to avoid the effect of stress constraint

Inactive Publication Date: 2006-05-03
山东合创涂层技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The consequence of this constraint is that it not only limits the dynamic stretching mechanical behavior of the film, but also may cause the contact between the film and the external circuit to be unstable, thus affecting the constant and continuous loading of the electric field.

Method used

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  • Method for determining metal film fatigue life in electro-mechanical coupling field
  • Method for determining metal film fatigue life in electro-mechanical coupling field

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] The polyimide flexible substrate is processed into a traditional tensile sample shape, the narrow and long area in the middle (20×6mm) is the effective working area of ​​the sample, and the wide areas at both ends are the tensile clamping area. The metal Cu thin film was deposited on the effective working area by magnetron sputtering deposition method, with a thickness of 20 microns, and the deposition process parameters were: sputtering power 150W; sputtering bias -80V; background pressure 4.5×10 -3 Pa; working Ar pressure 1Pa. The sample is placed horizontally on the micro-tensile testing machine, the two ends of the sample are respectively clamped by the tensile chuck, the roller contact device is tightly in contact with the copper film, and the two rollers are respectively connected to the two poles of the current application device. form a current loop. Electrical and mechanical loads were applied simultaneously, with a voltage of 12V and a stress amplitude of 2-2...

Embodiment 2

[0020] The polyimide flexible substrate is processed into a traditional tensile sample shape, the narrow and long area in the middle (20×6mm) is the effective working area of ​​the sample, and the wide areas at both ends are the tensile clamping area. The metal Al thin film was deposited on the effective working area by magnetron sputtering deposition method, with a thickness of 200 nm, and the deposition process parameters were: sputtering power 200W; sputtering bias -70V; background pressure 4.5×10 -3 Pa; working Ar pressure 1Pa. . The sample is placed horizontally on the micro-tensile testing machine, the two ends of the sample are respectively clamped by the tensile chuck, the roller-type contact device is tightly contacted with the aluminum film, and the two rollers are respectively connected to the two poles of the current application device. form a current loop. Electrical and mechanical loads were applied simultaneously, with a voltage of 6V and a stress amplitude of...

Embodiment 3

[0022] The polyimide flexible substrate is processed into a traditional tensile sample shape, the narrow and long area in the middle (20×6mm) is the effective working area of ​​the sample, and the wide areas at both ends are the tensile clamping area. The metal Cu thin film was deposited on the effective working area by the magnetron sputtering deposition method, the thickness was 2.5 microns, and the deposition process parameters were: sputtering power 150W; sputtering bias -80V; background pressure 4.5×10 -3 Pa; working Ar pressure 1Pa. The sample is placed horizontally on the micro-tensile testing machine, the two ends of the sample are respectively clamped by the tensile chuck, the roller contact device is tightly in contact with the copper film, and the two rollers are respectively connected to the two poles of the current application device. form a current loop. Electrical and mechanical loads were applied simultaneously, with a voltage of 8V and a stress amplitude of 2...

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Abstract

The invention discloses a method for measuring mental hull fatigue life on the force / electrical coupling field, which deposits the mental hull on the polyimide soft base plate. The minimum tensile load makes the mental hull to generate yield force, the soft base plate is at elastic deforming stage, when loading it, and the mental hull inner part will generate the compressive stress to achieve the mental hull drag-press fatigue circulating load. The electrical loading exerts method of the mental hull uses cylinder contact device. It exerts the circulating force and the electrical loading on the mental hull and uses the mutation of the mental hull shift amplitude with permanent loading amplitude or on the control of the loading amplitude to hand the forming of the mental fatigue defection and shows the fatigue life.

Description

technical field [0001] The invention relates to a test method for the fatigue life of metal thin film materials, which is suitable for evaluating the fatigue life of metal thin film materials under the coupling action of force field / electric field in industries such as microelectronics. Background technique [0002] Metal thin film materials (such as Cu and Al) used as metallization wiring are widely used in VLSI and microelectromechanical systems (MEMS). These thin film materials are often subjected to cyclic stress during multiple microprocessing preparations and in use. role. At the same time, due to the action of the electric pulse signal and the accompanying temperature cycle and the thermal mismatch between the metal film and the base material, the metal film material is subjected to multi-field coupling of cyclic force / electricity / heat. The service behavior and fatigue life evaluation and prediction of metal thin film materials under dynamic multi-field coupling have...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N35/00G01N3/08G01N27/00
Inventor 孙军刘刚牛荣梅宋忠孝徐可为
Owner 山东合创涂层技术有限公司
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