Fluoro-rubber composite, rubber material using the same, and a method of manufacturing a fluoro-rubber molded product

Abstract

The present invention provides a fluororubber composition that is less likely to reduce the cleanliness of the manufacturing environment and is less prone to cracks, a rubber material using the composition, and a method for producing a fluororubber molded body. The fluororubber, tetrafluoroethylene / propylene copolymerized Compound or tetrafluoroethylene / propylene / vinylidene fluoride copolymer mixed with fluorine-containing thermoplastic resin, and added peroxide crosslinking agent, co-crosslinking agent and other necessary fillers to form a fluororubber composition, through crosslinking The fluororubber composition is used to obtain a fluororubber molded body. As a crosslinking method, for example, a mold having a desired shape is filled with a certain amount of the fluororubber composition, and primary crosslinking is performed through a heating step. Then, secondary crosslinking can be performed in an oven at 150° C. to 250° C. for 1 hour to 32 hours as needed. The shape of the fluororubber molded article may be, for example, a sheet shape, a rod shape, a ring shape, various complicated block shapes, etc., and it can be formed into any shape according to its use.

Description

technical field [0001] The present invention relates to fluorine rubber moldings, especially rubber materials used in parts requiring free radical resistance, purity, and low gas emission, as well as rubber materials used in semiconductor manufacturing equipment, semiconductor transportation equipment, etc., and their production method. Background technique [0002] In the manufacture of semiconductors and liquid crystals, O 2 Plasma or CF 4 Plasma and other plasma for processing. In such a device using plasma, various connection parts and movable parts are sealed using an elastomeric sealing material. [0003] In recent years, in order to improve the productivity of semiconductor manufacturing, high-density plasma of dry etching equipment, which is one of semiconductor manufacturing equipment, has been advanced. With high-density plasma, the density of radicals contained in the plasma also increases, and the rubber sealing material used in such devices is decomposed and...

AI Technical Summary

Problems solved by technology

[0005] However, the problem of the above-mentioned prior art is that carbon black and silicon dioxide form particles (foreign particles, particles), and the moisture adsorbed on them is released, which reduces the cleanliness of the manufacturing environment, and it is difficult to meet the semiconductor processing standards. The cleanliness required by the current semiconductor manufacturing equipment and semiconductor transportation equipment

Furthermore, this prior art also has the problem of not being able to suppress cracking of the sealing material.

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