Method of fabricating PCB including embedded passive chip
A passive chip and embedded technology, applied in the fields of printed circuit manufacturing, final product manufacturing, containing printed electrical components, etc., can solve problems such as difficult handling, long distance of integrated circuits, inability to form circuits with capacitor chips, etc.
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[0040] Figures 1a to 1e is a cross-sectional view illustrating a method of manufacturing a PCB containing embedded passive chips according to a first embodiment of the present invention
[0041] Such as Figure 1a As shown, according to the photolithography method, a circuit pattern is formed on the copper foil 102 of the substrate 100 constituting the core layer, and an insulator 111 or a raw material layer 110 having The insulator 111 is composed of a copper foil 112 formed on one side of the insulator 111 .
[0042] The copper-clad laminate used as the substrate 100 can be classified according to the application: glass / epoxy resin copper-clad laminate, heat-resistant resin copper-clad laminate, paper / phenol copper-clad laminate, high-frequency copper-clad laminate laminates, flexible copper-clad laminates and composite copper-clad laminates. However, it is preferable to use a glass / epoxy copper clad laminate 100 in which copper foils 102, 103 are plated on an insulating ...
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