Heat insulating construction for piping and heat insulating tool kit

Abstract

There are provided a heat insulating tool kit for piping. The heat insulating tool kit includes a piping; a band-shaped heat insulating unit which includes at least a heat insulating material and preferably a heating element and is wrapped with a heat-resistant resin film; a support cover consisting of a tubular element of a C-shaped cross section having a slit-shaped opening over the total length in the axial direction of the tubular element; and preferably an external cover of almost the same shape as that of the support cover. The heat insulating construction is formed as described below. The heat insulating unit is housed so that the non-heating surface of the heat insulating unit comes into contact with the tubular element inside wall of the support cover, and in a state in which ear portions at both ends of a heat insulating portion are pulled out of the slit-shaped opening, the butting portion at both ends of the heat insulating portion, that is, the slit-shaped opening of support cover is pressed on the piping, by which the piping is covered with the heat insulating portion and the support cover. Next, the opening portion of external cover in a widened state is pressed on the slit-shaped opening side of the support cover, by which the heat insulating unit and the support cover are collectively covered with the external cover.

Description

technical field [0001] The present invention relates to a thermal insulation structure of a pipeline and a complete set of thermal insulation tools, more specifically, it relates to a pipeline that can be easily and repeatedly assembled and disassembled in a narrow space, and can be fixed in a stable form. High efficiency, no overheating of the heating part, stable temperature control, very little dust generation, heat insulation kit for pipelines that can be used in clean rooms, etc., and heat insulation structure using the kit. Background technique [0002] Conventionally, in manufacturing plants of semiconductors, liquid crystals, electronic components, etc., reactive gases, processing liquids, and the like have been used in processes such as transfer processes, etching processes, and cleaning processes. Pipes for transporting these reactive gases and treatment liquids are provided with insulation structures according to the conditions of use. At this time, at the proces...

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Problems solved by technology

Furthermore, since the adhesive must be applied again in the case of repeated use, it is very troublesome, and it is not suitable for multiple uses (refer to Patent Document 2)

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