Multi-layer distribution board and mfg method, electronic device and electronic apparatus

Abstract

A multilayer circuit board and a manufacturing method for producing the board via simple manufacturing processes employing a droplet jetting method, where the inter-layer insulating film can be easily made flat. The multilayer circuit board includes at least two wiring layers, an inter-layer insulating film provided between every adjacent two of the wiring layers, and conductive posts for providing electrical conductivity between the wiring layers. The manufacturing method includes the step of forming the inter-layer insulating film by changing the film thickness of the inter-layer insulating film according to a concavo-convex shape of an area where the inter-layer insulating film is formed, so as to level an upper surface of the inter-layer insulating film. The concavo-convex shape may be computed based on design data of a circuit pattern for forming the wiring layers and the conductive posts, or may be measured before the inter-layer insulating film is formed.

Description

[0001] This application claims priority from Japanese Patent Applications No. 2002-334915 filed on Nov. 19, 2002 and No. 2003-300143 filed on Aug. 25, 2003, the contents of which are incorporated herein by reference. technical field [0002] The invention relates to a multilayer circuit board, a manufacturing method, an electronic device and an electronic device. Background technique [0003] In general, inner layer insulating films used in multilayer printed circuit boards are generally produced by spin coating or roll coating. According to the spin coating method, after dropping a liquid material on the substrate, the substrate is rotated to coat the entire surface of the substrate with the liquid material to form an insulating film. In roll coating, the solvent film is transferred to a press roll. But in the spin coating method, the actual material usage efficiency is close to 10%, and additional processes such as cleaning the backside are required. The roll coating met...

AI Technical Summary

Problems solved by technology

Then, in the wiring layer, the inner layer insulating film is formed in conformity with the uneven circuit pattern, and the flatness of the inner layer insulating film is insufficient.

With such an uneven interlayer insulating film, the upper part of the interlayer insulating film is also uneven, so that a flat wiring layer cannot be formed.

In addition, the cross-sectional shape of the upper inner layer insulating film or wiring layer will also be affected, resulting in disconnection between the wiring layers.

If the substrate is rotated, the material usage efficiency will be reduced and additional processes such as cleaning the backside will be required

Images