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Thermosetting adhesive

An adhesive, thermosetting technology, applied in the direction of adhesives, adhesive types, film/sheet adhesives, etc., can solve the problems of reducing the fluidity, difficulty, and reduction of adhesive strength of reactive hot melt adhesives

Inactive Publication Date: 2004-05-26
3M INNOVATIVE PROPERTIES CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is difficult to reduce mobility even at low doses of radiation
Moreover, even though the flow of reactive hot melt adhesives can be reduced by relatively low doses of radiation, the bond strength still decreases with

Method used

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Examples

Experimental program
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Effect test

preparation example Construction

[0030] The preparation of sulfonium salts of cationic polymerization catalysts is generally as follows. Sulfonium salts containing methylsulfate ions can be synthesized by reacting alkyl sulfates with the corresponding 4-substituted hydroxyphenyl alkyl sulfides. Next, it is anion-exchanged with a predetermined double salt to obtain the desired sulfonium salt in high yield. A sulfonium salt was commercially provided by Sanshin Kagaku Kogyo (KK) instead of the manufacture described above, which will be described later in the Examples.

[0031] The adhesive compositions of the invention described above can be used in the form of reactive hot melt film adhesives. The thickness of the film adhesive is preferably 0.001-5 mm, more preferably 0.005-0.5 mm. Due to the uniform cross-linked structure established in the thickness direction, the operation is convenient and the reliability is also high.

[0032] Film adhesives were produced by the method described below. First, the adhes...

Embodiment

[0052] The present invention will be described in detail in the following examples, but the present invention is not limited to these examples.

[0053] 1. Manufacture of film adhesive

[0054] The components in the proportions shown in Table 1 were kneaded at 120°C for 5 minutes to prepare an adhesive composition. Next, a pair of polyethylene terephthalate films (hereinafter referred to as "PET" films) having a length of 1 m, a width of 15 cm, and a thickness of 100 μm were prepared, sandwiching the prepared adhesive composition therebetween. The assembly was then passed through a knife-shaped gap and heated to 150°C to shape it into a 100µm thick film precursor. These film precursors were colorless and transparent, except for the film product precursor of Comparative Example 3, which was yellow.

[0055] In the next step, the film precursor will be irradiated with an electron beam accelerated at 200KV to obtain a film adhesive, and the absorbed dose at this time is 150kGy....

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Abstract

A thermosetting adhesive which produces no foul odor or discharged gas, or form no bubbles under irradiation, and which exhibits a satisfactorily high bonding property, even under low-dose irradiation. The thermosetting adhesive contains an ethylene-glycidyl (meth)acrylate copolymer, whose principal monomer components are an ethylene and a glycidyl (meth)acrylate, and a sulphonium salt-comprising cationic polymerization catalyst.

Description

field of invention [0001] The present invention relates to an adhesive containing a thermosetting resin, hereinafter referred to as "thermosetting adhesive". Background of the invention [0002] Thermosetting adhesives can form a three-dimensional crosslinked structure (also called network structure or bridge structure) under the action of heat. It generally contains epoxy resin as the thermosetting resin. The thermosetting resin forms a cross-linked structure between the molecules of the epoxy resin, showing mechanical properties, heat resistance, weather aging resistance and very good adhesive strength. [0003] Known thermosetting adhesives containing epoxy resins are reactive hot melt adhesives. Reactive hot melt adhesives are hot pressed on the substrate and then exposed to heat or light to crosslink and cure the epoxy resin, resulting in very strong adhesion and very good heat resistance, etc. [0004] Typical hot melt adhesives are described in Japanese Patent Appl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C08G59/68C08K5/36C08K5/375C08L23/08C09J7/35C09J123/08
CPCC08G59/687C08K5/36C09J123/08C09J2205/114C09J7/0203C09J2423/00C08L23/0884C08K5/375C08L2205/02C09J2433/00C09J2463/00C09J7/35C08L2666/02C08L2666/28C09J2301/414C08L33/14C08L23/08
Inventor 正朗武田川手恒一郎石井荣美鸟海尚之伊藤広治原富裕
Owner 3M INNOVATIVE PROPERTIES CO
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