Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Multiple etching technique for imitating cast copper, and its products

A technique of etching and casting copper, which is used in crafts and decorative arts for producing decorative surface effects to achieve realistic and three-dimensional artistic effects.

Inactive Publication Date: 2004-03-10
金星铜集团有限公司
View PDF2 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Can find to improve etching speed (" additive for copper etchant ", application number 94193307.5) and fineness (" copper and copper alloy surface fine etching technology ", application number 94113369.9) aspect literature in Chinese patent database, but do not have about A report on the effect of imitation cast copper obtained by further processing the etched surface

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multiple etching technique for imitating cast copper, and its products
  • Multiple etching technique for imitating cast copper, and its products

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] The present invention will be described in further detail below in conjunction with the embodiments.

[0014] In the process embodiment, a copper plate is taken as an example. In this example, according to the protective layer diagram decomposed from the general design graphic, first coat the protective layer T1 on the base surface 1 of the copper plate (see Figure 2a), perform an etching for 20 minutes (single depth of 0.3mm), clean and form A new surface composed of surface 2 and base surface 1 is etched once (see Figure 2b). Randomly distributed protection spots T2 were locally splashed on the new surface (see Figure 2c), and the secondary etching was performed for 10 minutes (0.2mm deep each time), and four layers of different depths were formed, that is, the primary etching surface. 2 and the secondary etching surface 4 formed thereon, the base surface 1 and the etching surface 3 formed thereon (see FIG. 2d). Randomly distributed protective spots T3 were locally ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A multi-etching technology for preparing the pseudo-classical cast copper article includes chemically etching the designed pattern on the basal surface of copper material, locally splashing the protecting liquid drips randomly on the newly generated surface, repeating said steps at least 3 times, and treating at least one layer surface to make it show basic copper color or copper oxide color. Its advantage is lifelike artistical effect.

Description

technical field [0001] The invention relates to metal surface chemical treatment technology, in particular to a multi-etching imitation casting copper process and its products. Background technique [0002] In the prior art, the main purpose of chemical etching is to form dots, lines, and surfaces that constitute graphics and text on the metal surface. Generally, one etching is enough, and the etched products will be cleaned, oxidized and colored as required in the next process. Can find to improve etching speed (" additive for copper etchant ", application number 94193307.5) and fineness (" copper and copper alloy surface fine etching technology ", application number 94113369.9) aspect literature in Chinese patent database, but do not have about The etched surface was further processed to obtain a report of imitation cast copper effect. Contents of the invention [0003] The technical problem to be solved in the present invention is to overcome the deficiency of the back...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B44C1/22C23F1/02
Inventor 朱炳仁朱军岷
Owner 金星铜集团有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products