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Multi-layer circuit module with multi-layer ceramic substrate and embedded passive element

A technology of passive components and multi-layer circuits, which is applied in the manufacture of multi-layer circuits, including printed electrical components, circuits, etc., can solve the problems of not being able to significantly and effectively save the area or volume of passive components, and wasting the integrated area of ​​modules.

Inactive Publication Date: 2002-07-03
IND TECH RES INST
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Therefore, using the above-mentioned traditional multi-layer technology, only the embedded signal traces can be used to improve the compactness of the circuit module, which cannot significantly and effectively save the area or volume occupied by the passive components in the product.
And in a wireless communication system, based on characteristic considerations, the external antenna elements need to consider the relative position of the integration, which wastes the integration area of ​​many modules

Method used

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  • Multi-layer circuit module with multi-layer ceramic substrate and embedded passive element
  • Multi-layer circuit module with multi-layer ceramic substrate and embedded passive element
  • Multi-layer circuit module with multi-layer ceramic substrate and embedded passive element

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Embodiment Construction

[0088] See first Figure 4 , Figure 4 An embodiment of the systematic multi-layer circuit module integrated design method of the present invention is described. The structure of the circuit module includes a multi-layer ceramic substrate (Multi-LayerCeramic) constructed by Low Temperature Co-fired Ceramic technology. ). These multi-layer structures can be divided into several integration areas according to the passive components used in the actual circuit.

[0089] These integration areas include internal wiring integration areas, basic passive component integration areas and high-frequency passive component integration areas. The wiring integration areas include connection layers, and the basic passive component integration areas can be subdivided into capacitor layers, resistor layers, and inductors. Floor. The high-frequency passive component integration area is reserved for high-frequency passive components, including filters, couplers, balanced and unbalanced impedanc...

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Abstract

A multi-layer circuit module with multi-layer substrate and embedded passive elements features that the ICs are installed on one or two surfaces, the connecting lines are arranged in internal tracingarea, the basic passive elements (capacitor, resistor and inductor) are arranged in basic passive element area, the high-frequency elements (filter, coupler, and impedance converter) are arranged in high-frequency passive element area, grounded bayers are used for isolating element to prevent electromagnetic interference, and standard I / O pins are formed on the surface of bottom surface.

Description

technical field [0001] The present invention relates to a multi-layer circuit module (multi-layer circuit module), in particular, to a highly integrated multi-layer circuit module and a method for designing and integrating the circuit module. The circuit module is equipped with multi-layer ceramic substrate and embedded passive components. Background technique [0002] figure 1 Describe the basic circuit architecture of a current wireless communication system. The basic components in this system include an RF front end circuit (RF front end circuit) 101, a modulation and demodulation module (modulation and demodulation module) 102, a base frequency control circuit (base band control circuit) 103 and a flash memory Module (flash memory module) 104 . Each basic component has a dedicated integrated circuit (integrated circuit) and peripheral components (peripheral device) to combine the required functions to meet the specifications required by the system. This system also i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/12H01L23/498H01L23/66H05K1/02H05K1/16H05K3/46
CPCH01L2924/0002H05K3/4629H01L2924/15311H01L2924/19106H01L23/66H05K1/16H01L23/49822H01L2924/3011H01L23/49816H01L2924/16152H01L2924/09701H01L2223/6677H01L2924/3025H01L2924/00
Inventor 周詠晃沈志文曾文仁王锦荔陈建宏汤敬文
Owner IND TECH RES INST
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