Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Valveless micro-pump and packaging method thereof

A micropump and pump body technology, which is applied in the packaging field of valveless micropumps, can solve problems such as inability to realize mass production, poor reliability, and difficult sealing, and achieve the effects of stable operation, high reliability, and good sealing performance

Inactive Publication Date: 2007-08-01
HARBIN INST OF TECH
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current valveless pump structure still has shortcomings such as difficult sealing, poor reliability, difficult production, and inability to achieve mass production.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Valveless micro-pump and packaging method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0011] Hereinafter, the present invention will be described in more detail with an example in conjunction with the accompanying drawings:

[0012] With reference to Figure 1, the composition of the valveless micropump includes a pump body 3 with an input port 1 and an output port 2 on the pump body. It also includes a piezoelectric ceramic buzzer 5. There is a concentric annular sealing elastic gasket 4 between the pump body and the piezoelectric ceramic buzzer. At the same time, referring to Figures 2 and 3, the shape of the annular sealing elastic gasket matches the shape of the pump cavity and the piezoelectric ceramic buzzer. , Can be round ring, rectangular ring, etc. A metal ring 6 is concentrically arranged on the piezoelectric ceramic buzzer, and a sealing adhesive resin glue 7 is arranged outside the annular sealing elastic pad, the piezoelectric ceramic buzzer and the metal ring.

[0013] The product of the present invention is packaged in such a way to make a valveless ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

This invention provides mini-size pump without valve and the encapsulation method. First making the body of pump, homocentric putting an annular hermetic stretch underlay in the cavity of the pump, putting piezoelectric chinaware buzzer on the underlay with its PZT side facing outside, homocentric placing a mental ring on the buzzer, using clamp to tighten the parts from top to bottom, then using hermetic resin glue to cement and solidify the parts. This invention has advantages of fine capacity of airproofing, stable functioning, high reliability, convenience of mass production and etc. This invention can be widely applied to mini-size airplanes, the thruster of mini-space probe, and the fields like micro-chemistry analysis and biological medicine.

Description

(1) Technical field [0001] The invention relates to a valveless micropump. The invention also relates to a packaging method of a valveless micropump. (2) Background technology [0002] Research work on valveless micropumps began in the early 1990s. In 1992, Richter et al. of Germany first proposed the use of valveless structures in the design of micropumps; in 1993, Sweden’s E. Stemmed et al. successfully adopted diffusion The port / nozzle structure made the micropump; in 1994, they made the first silicon-based valveless micropump based on the working principle of the valveless structure, and used anisotropic etching on (100) silicon wafers to form a pyramidal diffusion Orifice / nozzle structure; then, T.Geriach et al. made a smaller valveless micropump (7×7×1mm 3 ); In 1995 and 1996, E.Stemmed and others proposed the equivalent circuit of the lumped parameters of the valveless micropump, and began to optimize the structure design of the valveless micropump, and proposed to pass is...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): F04B43/04
Inventor 刘晓为张国威田丽王喜莲
Owner HARBIN INST OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com