Magnetic material bottom filling method in chip packaging

A magnetic material and bottom filling technology, which is applied in the field of magnetic material bottom filling and controlled bottom filling magnetic composite materials, can solve the problems of reducing filling time, achieve the effects of reducing filling time, improving device reliability, and avoiding accumulation and waste

Inactive Publication Date: 2006-09-20
SHANGHAI JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to address the deficiencies in the prior art and propose a method for underfilling magnetic materials in chip packaging, which can reduce filling time, effectively avoid voids or even incomplete filling defects, and improve packaging efficiency

Method used

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  • Magnetic material bottom filling method in chip packaging
  • Magnetic material bottom filling method in chip packaging
  • Magnetic material bottom filling method in chip packaging

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Embodiment approach

[0021] Main implementation method of the present invention is as follows:

[0022] 1. Selection of magnetic materials and preparation of magnetically filled composite materials

[0023] Alternative magnetic materials include inorganic magnetic materials and organic magnetic materials. The bottom filling material used in the present invention is a soft magnetic composite material containing magnetic powder. The magnetic powder is required to have low remanence and high resistivity. The Curie temperature is lower than that of commonly used inorganic magnetic materials to ensure that the magnetic composite material filled between the chip and the substrate is weakened or even completely demagnetized after curing. The metallocene polymer magnet synthesized from metallocene is black powder (fine powder). The powder is a soft magnetic material with high magnetic permeability, high resistivity, low remanence, and the Curie temperature is much lower than other Inorganic magnetic mate...

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Abstract

In the invention, magnetism micropowder material is used as filling material to be substituted for SiO2, an electromagnetism exciting head is mounted on a scanning axle of electromagnetism scanning mechanism and is set above chip or under substrate to exert external electromagnetism force in glue dripping and filling process, to exciting electromagnetism scanning along direction of glue dripped on forward position of filling material from beginning to end, to guiding magnetism organic material to be filled. The magnetism material is easy to be prepared. The external electromagnnetism force action is used to reduce filling time and increase reliability of component.

Description

technical field [0001] The invention relates to a method for filling the bottom of a magnetic material in chip packaging, in particular to a method for filling a magnetic composite material under a controlled bottom using external excitation, and belongs to the field of electronic packaging of integrated circuit manufacturing. Background technique [0002] In the flip-chip technology of electronic packaging, in order to improve the reliability of the device, it is necessary to fill the high-strength adhesive material (Underfill Material) between the chip and the base material, which is composed of a polymer (such as epoxy resin) and poly It is made by mixing various additives (such as hardener, catalyst, filling powder, coupling agent, etc.). The filling process includes two forms: flow underfill and no-flow underfill. In electronic packaging, interface delamination caused by thermal mismatch between different materials is the main cause of packaged device failure. The und...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/54H01L21/56
Inventor 叶献方丁汉
Owner SHANGHAI JIAOTONG UNIV
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