Integrated circuit packaging substrate

Abstract

The invention discloses an integrated circuit packaging substrate, and relates to the technical field of industrial production. The integrated circuit packaging substrate comprises a fixed bottom plate, a substrate is arranged on the upper side of the fixed bottom plate, two airflow grooves are formed in the fixed bottom plate, a heat dissipation channel is formed between the two airflow grooves, the two airflow grooves are communicated through the heat dissipation channel, and a spring groove is formed in the lower side of the fixed bottom plate. According to the integrated circuit packaging substrate, in the using process, if a chip on the upper side of the substrate is high in temperature, the temperature of the lower side of the substrate can rise, at the moment, gas in the gas cavity expands to enable the sliding plate to move upwards passively, the substrate is supported by the connecting rod, the fixed bottom plate descends, and the gap between the substrate and the fixed bottom plate becomes large; the purposes that the distance between the substrate and the upper side of the fixed bottom plate is increased, and the heat dissipation speed can be increased are achieved.

Description

technical field [0001] The invention relates to the technical field of industrial production, in particular to an integrated circuit packaging substrate. Background technique [0002] Integrated circuit packaging is advancing with the development of integrated circuits. With the continuous development of various industries such as aerospace, aviation, machinery, light industry, and chemical industry, the whole machine is also changing in the direction of multi-function and miniaturization. In this way, the integration of integrated circuits is required to be higher and higher, and the functions are more and more complex. Correspondingly, the packaging density of integrated circuits is required to increase, the number of leads is increasing, the volume is getting smaller and lighter, the weight is getting lighter, and the replacement is getting faster and faster. During the use process, due to the small size and high density, it will make it The temperature cannot be fully ...

AI Technical Summary

Problems solved by technology

In this way, the integration level of integrated circuits is required to be higher and higher, and the functions are more and more complex.

Correspondingly, it is required that the packaging density of integrated circuits is increasing, the number of leads is increasing, the volume is getting smaller and lighter, and the replacement is getting faster and faster. Due to the small size and high density during use, it will make it The temperature cannot be fully diverged, so that it will be in a high temperature environment for a long time, and its service life will be shortened. Therefore, a device is needed to achieve the purpose of rapid heat dissipation

Images