Heat dissipation method of electronic integrated module

Abstract

The invention discloses a heat dissipation method of an electronic integrated module, which comprises the following steps of: A, respectively connecting a transverse auxiliary radiator and a vertical radiator by using a transverse circulating heat exchange assembly in which a cooling medium is arranged, and installing the electronic integrated module on the vertical radiator; b, a cooling medium is controlled to flow circularly, heat generated by the electronic integration module is continuously dissipated in a vertical heat dissipation mode through a vertical heat dissipation device, and meanwhile heat exchange is continuously conducted between the heat generated by the electronic integration module and the cooling medium flowing circularly; the cooling medium after heat absorption circularly flows to the transverse auxiliary radiator, and the heat is transversely conducted to the transverse auxiliary radiator for heat dissipation; and repeating the steps until the heat dissipation of the electronic integrated module is completed. According to the method, heat dissipation is carried out on the electronic integration module in a mode of combining transverse conduction heat dissipation and vertical conduction heat dissipation, and the technical problems that in the prior art, the heat dissipation performance is poor, and deep integration of intelligent equipment is not facilitated are solved.

Description

technical field [0001] The invention belongs to the technical field of electronic heat dissipation, and particularly relates to a heat dissipation method for an electronic integrated module. Background technique [0002] At present, all walks of life are moving in the direction of intelligence. And with the rapid development of science and technology, there are more and more types of intelligent equipment. But no matter what kind of intelligent equipment, it is inseparable from the electronic components that play the core control role. For the current intelligent equipment, it is usually necessary to integrate various electronic components into a whole electronic integrated module, and the integration degree of the electronic integrated module largely determines the structure and volume of the intelligent equipment. For example, the higher the integration degree of the electronic integrated module, the more precise the structure of the intelligent equipment, the smaller th...

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Problems solved by technology

[0005] The purpose of the present invention is to solve the above-mentioned problems existing in the prior art. It provides a heat dissipation method for an electronic integrated module. Effectively improve heat dissipation efficiency and heat dissipation effect on the premise of reducing the volume of the vertical heat dissipation structure, and solve the technical problems of poor heat dissipation performance of electronic integrated modules and unfavorable for deep integration and miniaturization of intelligent equipment in the prior art

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