Mini/microLED bonding pad intelligent cleaning device

Abstract

The invention relates to a Mini / microLED bonding pad intelligent cleaning device which comprises a mounting plate, a cleaning assembly, an injection valve and a vibration assembly, the cleaning assembly is mounted on the front end face of the mounting plate and used for cleaning residues on a bonding pad, the injection valve is mounted on the left side of the front end of the mounting plate, and the vibration assembly is mounted on the lower side of the front end face of the mounting plate and used for cleaning residues on the bonding pad. The front end of the mounting plate drives the cleaning assembly to perform vibration cleaning on the bonding pad. The device can solve the problems that when an existing device cleans a bonding pad, many solder paste residues often exist on the bonding pad, the residues on the bonding pad cannot be effectively and accurately cleaned, the follow-up installation effect of an LED is affected, and meanwhile when the existing device cleans the bonding pad, the residues cannot be effectively and accurately collected, and the service life of the LED is prolonged. And the residues are easy to fall again, so that secondary pollution of the residues is caused, and subsequent installation of the LED is not facilitated.

Description

technical field [0001] The invention relates to the technical field of Mini / microLED production, in particular to an intelligent cleaning device for Mini / microLED pads. Background technique [0002] Mini / microLED is a new generation of display technology with self-luminous display characteristics. Compared with the existing organic light emitting diode technology, Mini / microLED display device has the advantages of higher brightness, better luminous efficiency and lower power consumption. When the LED is damaged, the damaged LED needs to be replaced. After the LED is removed, there will often be solder paste residue on the surface of the pad, so it is necessary to clean up the residue on the pad in time to prevent the replacement of new ones. LED lighting failure occurs. [0003] At present, the existing equipment usually has the following defects when cleaning the pads: 1. When the existing equipment cleans the pads, there are often more solder paste residues on the pads, w...

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Problems solved by technology

[0005] The present invention can solve the problem that when the existing equipment cleans the pads, there are often more solder paste residues on the pads, which cannot effectively clean the pads. Accurate cleaning of the residue on the pad will affect the follow-up installation effect of the LED. At the same time, when the existing equipment cleans the pad, it cannot effectively collect the residue accurately, and the residue is prone to fall again phenomenon, leading to secondary pollution of residues, which is not conducive to the subsequent installation of LEDs and other problems

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