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Field replaceable module

An on-site, radiator technology, applied in the field of avionics system, can solve problems such as heat pipe damage, achieve the effect of improving reliability, avoiding fatal damage, and satisfying high power consumption

Pending Publication Date: 2022-07-01
西安超越申泰信息科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Moreover, the LRM module has surface spraying requirements, and the high temperature during spraying will cause fatal damage to heat pipes, etc.

Method used

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Embodiment Construction

[0027] The solution provided in this specification will be described below with reference to the accompanying drawings.

[0028] An embodiment of the present invention provides a field replaceable module, and the field replaceable module may be abbreviated as an LRM module.

[0029] see Figure 1 ~ Figure 4b , the field replaceable module provided by the embodiment of the present invention includes a heat dissipation bottom cover 1 and a heat dissipation top cover 4, the heat dissipation bottom cover 1 is a semi-closed cubic structure with an open top, and the top of the heat dissipation bottom cover 1 and the heat dissipation The top cover 4 is fixedly connected to form a closed cubic structure, and the heat dissipation bottom cover 1 and the heat dissipation top cover 4 are provided with heat dissipation fins;

[0030] The module also includes: a main board 8, a cpu 5, a power supply chip 6 and a bridge chip group 37 arranged inside the closed cube structure; the cpu is arr...

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Abstract

The field replaceable module comprises a heat dissipation bottom cover and a heat dissipation top cover, the heat dissipation bottom cover is of a semi-closed cubic structure with the top open, the top of the heat dissipation bottom cover is fixedly connected with the heat dissipation top cover to form a closed cubic structure, and heat dissipation fins are arranged on the heat dissipation bottom cover and the heat dissipation top cover; the module further comprises a mainboard, a CPU, a power supply chip and a bridge sheet group which are arranged in the closed cubic structure. The CPU is arranged on the front surface of the mainboard, and the bridge sheet group is arranged on the back surface of the mainboard; the module further comprises a first heat dissipation unit and a second heat dissipation unit. The first heat dissipation unit is of a detachable structure connected with the heat dissipation top cover in an attached mode and is used for transmitting heat generated by the CPU to the heat dissipation top cover. The second heat dissipation unit is of a detachable structure connected with the heat dissipation bottom cover in an attached mode and is used for transmitting heat generated by the bridge piece set to the heat dissipation bottom cover.

Description

technical field [0001] The invention relates to the technical field of avionics systems, in particular to a field replaceable module. Background technique [0002] The field replaceable module (ie LRM module) is the hardware foundation of the fourth-generation integrated avionics system. It is gradually recognized by the military market due to its high degree of standardization, small size, and easy maintenance, and is increasingly used in In harsh environments, such as the wild, humid, salt spray, high temperature, hot and humid environment. [0003] The LRM module cannot place a fan due to its small space and airtight design. In order to protect the stability of the equipment and the performance against harsh environments, it is necessary to quickly take away the heat generated by the CPU, bridge chips, power modules, and power chips of the high-power consumption devices. This is a key problem that needs to be solved, and it is also a difficult problem. Moreover, LRM mod...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H05K1/18H05K1/02H01L23/367
CPCH05K7/20418H05K7/20H05K1/18H05K1/021H01L23/3675H01L23/367
Inventor 秦新玲国林钊李圣路
Owner 西安超越申泰信息科技有限公司
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