Dual one-dimensional micro-electro-mechanical mirror element

Abstract

The invention provides a dual one-dimensional micro-electro-mechanical mirror element, which comprises a substrate, a first one-dimensional micro-electro-mechanical scanning chip, a second one-dimensional micro-electro-mechanical scanning chip and an upper cover, the first and second one-dimensional micro-electro-mechanical scanning chips are welded on the substrate; the upper cover is fixed on the substrate so as to cover the first and second one-dimensional micro-electro-mechanical scanning chips therein, and the upper cover forms a first window and a second window corresponding to the first and second one-dimensional micro-electro-mechanical scanning chips; the first one-dimensional micro-electro-mechanical scanning chip and the second one-dimensional micro-electro-mechanical scanning chip which are manufactured in advance are arranged at different positions on the same substrate, so that vibration interference applied to a vibration environment can be overcome easily, and the light-transmitting area of the upper cover is only the first window and the second window and can transmit light. The light incident to the first and second one-dimensional micro-electro-mechanical scanning chips can be effectively prevented from being influenced by ambient light.

Description

technical field [0001] The present invention relates to a microelectromechanical mirror element, in particular to a double one-dimensional microelectromechanical mirror element. Background technique [0002] The existing projection equipment adopts a micro-electromechanical scanning device to project the generated image beam to form a projection screen. At present, the MEMS scanning device of projection equipment mainly consists of two MEMS mirror scanning chips. Each of the MEMS mirror scanning chips includes a mirror element to project the projection screen. The mirror of one MEMS mirror scanning chip is controlled along the horizontal axis. (H-axis) rotation, while the mirror element of another MEMS mirror scanning chip is controlled to rotate along the vertical axis (V-axis). Since the mirror is a rotatable structure, when the projection equipment is used in a vibrating environment, the vibration force will shake the mirror elements of the two MEMS mirror scanning chips...

AI Technical Summary

Problems solved by technology

However, the micro-electromechanical micro-mirror element 60 is manufactured using a semiconductor manufacturing process, which is not only expensive to manufacture, but also difficult to adjust the size of the mirror (the mask needs to be redesigned), the position of the mirror according to different projection requirements, and the light-transmitting top 64 and the light-transmitting bottom 65 can fully transmit light, and its incident light 67 is easily affected by ambient light, which makes the final image quality worse; therefore, it is necessary to improve

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