Loudspeaker with FPC (flexible printed circuit) and bonding pad integrally formed and assembly method of loudspeaker
A loudspeaker and pad technology, applied in the field of loudspeakers, can solve the problems of easy fatigue and breakage of voice coil leads, and achieve the effect of avoiding fatigue and improving work efficiency.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0040] refer to figure 1 -7, a loudspeaker with an FPC and a pad integrally formed, comprising: a lower casing 1, a diaphragm 2, a magnetic circuit system 3, a voice coil 4 and an FPC5;
[0041] The diaphragm 2 and the lower casing 1 form a corresponding sound cavity, and the FPC 5 is arranged in the sound cavity; in this embodiment, the FPC 5 is arranged in the sound cavity as a component for transmitting audio signals, and passes through the pads. 6 is connected to the audio signal output point of the external circuit, so that the audio signal is transmitted to the FPC5 through the pad 6.
[0042] The FPC 5 and the pad 6 are integrally formed, the FPC 5 is electrically connected to the pad 6 , the lower casing 1 is provided with a pad placement position, and the pad 6 is drawn out from the interior of the sound cavity and It is fixed at the placement position of the pad; in this embodiment, since the FPC5 is arranged inside the sound cavity, and the pad 6 and the FPC5 are i...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com