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Method for tinning nickel-plated layer by adopting preformed soldering lug

A technology of preformed solder pieces and nickel-plated layers, applied in welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of low production efficiency, inability to precisely control the amount of solder, and high technical requirements for operation, so as to ensure the effect of tin enamel. , The effect of improving production efficiency and product quality

Pending Publication Date: 2022-06-24
SHENZHEN ZHENHUA MICROELECTRONICS
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Problems solved by technology

[0004] This application aims to solve the problem that when applying solder paste to nickel-plated shells, it is usually manual operation, which requires high technical requirements, cannot ensure that the solder paste on multiple nickel-plated shells is evenly applied, and the amount of solder cannot be precisely controlled, resulting in production To solve the technical problem of low efficiency, a method of tinning the nickel-plated layer by using solder preforms is provided

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  • Method for tinning nickel-plated layer by adopting preformed soldering lug

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Embodiment Construction

[0023] It should be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application.

[0024] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the implementations. example. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of this application.

[0025] It should be noted that the terms "comprising", "comprising" and "having" in the description and claims of the present application and the above-mentioned drawings, as well as any modifications thereof, are intended to cover non-exclusive inclusion. For exa...

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Abstract

The invention provides a method for tinning a nickel-plated layer by adopting a preformed soldering lug, which is applied to the field of circuit processing and is used for cleaning the surface of a nickel-plated layer shell for tinning. Manufacturing a preformed soldering lug matched with the nickel-plated layer shell in size; the preformed soldering lug is attached to the shell with the nickel plating layer; carrying out preheating treatment on the nickel-plated layer shell with the pre-formed soldering lug for 2 minutes at the temperature of between 100 DEG C and 200 DEG C after the nickel-plated layer shell with the pre-formed soldering lug is attached; the method has the advantages that the problems which cannot be solved by an existing nickel-plated layer shell treatment method are solved, and the method replaces soldering paste smearing to conduct pre-tinning on the shell, so that the tinning effect is guaranteed, and meanwhile the production efficiency and the product quality are improved; the preformed soldering lug matched with the nickel-plated layer shell can be fully automatically machined, intelligent operation is achieved, the soldering tin amount on the nickel-plated layer shell is uniform and consistent, and the situation that all soldering paste has smearing errors in manual operation of the soldering paste is avoided through reciprocating mechanical machining.

Description

technical field [0001] The present application relates to the technical field of circuit processing, and in particular, to a method for enamelling a nickel-plated layer with solder preforms. Background technique [0002] In the process of assembly and production of the current thick-film hybrid circuit, it is necessary to apply solder paste to the nickel-plated shell to achieve pre-tinning to improve the soldering reliability. When applying solder paste to the nickel-plated shell, it is usually a manual operation. , the operating technology requirements are high, the solder paste on the multiple nickel-plated shells cannot be guaranteed to be evenly spread, and the amount of solder cannot be accurately controlled, resulting in low production efficiency; [0003] Chinese patent CN201910701201.7 discloses a high-reliability application of a pretreatment method for QFN assembly and soldering of printed circuit board components. Solder paste that is consistent with the distribu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/20
CPCB23K1/20B23K1/206
Inventor 敖艳金苏律铭
Owner SHENZHEN ZHENHUA MICROELECTRONICS
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