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Real-time monitoring method and system for falling, sucking and mounting of elements in chip mounter

A real-time monitoring and placement machine technology, which is applied in the direction of assembling printed circuits, electrical components, electrical components, etc., can solve the problem that it is difficult to effectively monitor the suction and placement status of components, and the suction vacuum pressure has a small range of changes , Affecting the quality of component placement and other issues, to achieve the effect of improving the success rate of absorption, simple calculation method, and improving reliability

Pending Publication Date: 2022-06-07
合肥安迅精密技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of the conventional method is that for the type of suction nozzle with small aperture, the range of suction vacuum pressure is small, and it is difficult to judge whether the component is picked up correctly by the change of vacuum pressure. In addition, when multiple suction nozzle rods generate vacuum air passages at the same time, there will be interference between each other. Certain interference, the vacuum pressure will also change
[0006] To sum up, it can be seen that conventional methods are difficult to effectively monitor component drop, component pick-up and component placement status, which in turn affects component placement quality

Method used

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  • Real-time monitoring method and system for falling, sucking and mounting of elements in chip mounter
  • Real-time monitoring method and system for falling, sucking and mounting of elements in chip mounter
  • Real-time monitoring method and system for falling, sucking and mounting of elements in chip mounter

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0072] A real-time monitoring method for component drop, such as figure 2 shown, including the following steps:

[0073] S11: The initialization vacuum pressure sampling rate is 12500Hz (sampling interval is 80μs), and the storage vacuum pressure array queue length is 100, then the queue length is 100*80μs=8ms and the component drop monitoring threshold (denoted as Threshold);

[0074] S12: as figure 2 As shown, when the nozzle rod of the placement head is in the suction state, the collected vacuum pressure data is stored in the array queue. When the array queue is not full, add the vacuum pressure data to the end of the previous one; when the array queue is full, collect 1 vacuum pressure data -70.3 and add it to the end of the array queue, and delete 1 data at the head of the array queue point-88.1;

[0075] S13: Determine whether the array queue is full of storage, if not, enter the step S12, if the storage is full, calculate the vacuum pressure change rate. According...

Embodiment 2

[0082] A real-time monitoring method for component pickup, such as Figure 4 shown, including the following steps:

[0083] S21: Initialization parameters, including vacuum pressure sampling rate of 12500Hz (sampling interval of 80μs), storage vacuum pressure array queue length of 100, queue length of 100*80μs=8ms, suction height of 0mm, suction timing of 50ms, vacuum pressure The difference threshold is 1.0kPa;

[0084] S22: The nozzle rod of the placement head is opened to inhale in advance and the nozzle rod is lowered;

[0085] S23: During the descending process of the nozzle rod, the sampled vacuum pressure data is stored in the array queue. When the array queue is not full, the vacuum pressure data is appended to the end of the previous one; when the array queue is full, one vacuum pressure data is collected. Data is added to the end of the array queue, and 1 data point at the head of the array sequence is deleted;

[0086] S24: When the nozzle rod descends to the "su...

Embodiment 3

[0089] A real-time monitoring method for mounted components, the realization flow chart is as follows Figure 5 shown, including the following steps:

[0090] S31: Initialize the "mounting height" and "mounting timing" parameters;

[0091] S32: After the nozzle rod descends until it reaches the "mounting height", the nozzle rod stops moving;

[0092] S33: execute the blowing action in parallel, start the "placement timing" timer and monitor the vacuum pressure;

[0093] S34: Real-time monitoring of vacuum pressure data and "mounting timing" timer, when it is detected that the vacuum pressure data is positive pressure, that is, when the value is greater than 0, it is considered that the component has been mounted, and the gas stop and nozzle rod are executed in parallel Rising action; when it is detected that the vacuum pressure is negative pressure, wait. When the "Place Timing" timer is triggered, the air stop and nozzle rod ascending actions are performed in parallel.

...

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Abstract

The invention relates to the technical field of chip mounter control, and particularly discloses a real-time monitoring method and system for falling, sucking and mounting of components in a chip mounter, and the real-time monitoring method comprises the following steps: initializing a vacuum sampling rate, and storing an array queue length and a threshold value of vacuum pressure; according to the vacuum sampling rate and the group queue length, vacuum pressure is collected in real time and stored in an array queue; monitoring whether the element falls or not in real time according to the vacuum pressure and the threshold value in the array queue; and / or, monitoring whether the element is sucked in real time according to the vacuum pressure and the threshold value in the array queue; and / or, monitoring whether the element is mounted in real time according to the vacuum pressure and the threshold value in the array queue. According to the scheme, element falling, element sucking and element mounting states can be efficiently and accurately monitored, and then the element mounting quality is influenced.

Description

technical field [0001] The invention relates to the technical field of placement machine control, in particular to a real-time monitoring method and system for component drop, suction and placement in a placement machine. Background technique [0002] The components used by the placement machine in production are too small, and some of the components are fragile. If a mechanical fixture is used for component picking and placement operations, it is easy to cause the fixture to fail or damage the components. Mounting components are often realized by vacuum pressure, and vacuum pressure technology is an important part of the placement machine. [0003] like figure 1 As shown, in a conventional placement machine, a single suction nozzle rod 1 of the placement head generates vacuum pressure through a vacuum air circuit, and a suction nozzle 2 is installed at the lower end of the suction nozzle rod 1, and the suction nozzle 2 uses the vacuum pressure to adsorb the components 3. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/30H05K13/08
CPCH05K3/30H05K13/082
Inventor 唐学峰于缓缓傅亚男吴欢欢贺琛元光远金长明
Owner 合肥安迅精密技术有限公司
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