A thin slice laser crystal cooling device and laser

Abstract

The invention relates to a thin-film laser crystal cooling device and a laser, belonging to the technical field of laser heat dissipation. The thin-film laser crystal cooling device sequentially includes a liquid inlet and outlet plate, a liquid separation plate and a direct cooling plate, and the liquid inlet and outlet plate is provided with a liquid inlet and a liquid inlet and outlet. The liquid return port, the liquid separation plate is provided with a liquid separation through hole, one side of the direct cooling plate is attached to the thin laser crystal, and the other side is provided with a cooling groove, and the cooling groove passes the liquid separation The through holes are respectively connected with the liquid inlet and the liquid return port. The invention can ensure that the cooling liquid is reasonably distributed to the width direction and the length direction of the thin laser crystal, improves the cooling uniformity of the thin laser crystal, and ensures the normal operation of the thin laser crystal. At the same time, compact integration can be realized, the thermal stress of the thin-film laser crystal can be effectively released, and the service life of the thin-film laser crystal can be improved.

Description

technical field [0001] The invention belongs to the technical field of laser heat dissipation, and in particular relates to a thin-film laser crystal cooling device and a laser. Background technique [0002] Thin-film lasers are a class of potential high-power lasers, and the thickness of thin-film laser crystals is generally on the order of millimeters. In the thin slice laser crystal module integrated system, not only the thin slice laser crystal needs to be efficiently cooled, precisely positioned, and compactly integrated, but also the requirements for stress release during the operation of the thin slice laser crystal must be met to ensure the working performance of the thin slice laser system. [0003] In the existing thin-film lasers, the thermal management method of thin-film laser crystals is unreasonable and cannot meet the requirements of efficient cooling. At the same time, the thermal management integration method of thin-film laser crystals is unreasonable. On...

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Problems solved by technology

[0003] In the existing thin-chip lasers, the thermal management method of the thin-chip laser crystal is unreasonable and cannot meet the requirements of efficient cooling. At the same time, the thermal management integration method of the thin-chip laser crystal is unreasonable. On the one hand, it cannot meet the requirements of stress release in the work of thin-film laser crystals, which will easily lead to the failure of efficient thermal management of thin-film laser crystals, and the ineffective release of working stress, which will affect the normal operation of thin-film laser crystals.

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