A chip color detection device

A color detection and wafer technology, applied in sustainable manufacturing/processing, climate sustainability, final product manufacturing, etc., can solve problems such as waste of manpower and material resources, inability to automatically classify wafers, wafer material caching, etc., to improve detection Accuracy, flexible coordination of movement, and the effect of improving detection efficiency

Active Publication Date: 2022-07-08
SUZHOU DINNAR TECH FOR AUTOMATION CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The traditional wafer color inspection equipment takes pictures of the wafers, and cannot automatically classify the wafers as qualified products. In addition, during the loading and unloading process of the wafers, the wafers cannot be cached, and manual loading or unloading is required. Unloading, wasting manpower and material resources

Method used

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  • A chip color detection device
  • A chip color detection device
  • A chip color detection device

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Embodiment Construction

[0040] In order to understand the above objects, features and advantages of the present invention more clearly, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments may be combined with each other under the condition of no conflict.

[0041] In the description of the present invention, it should be understood that the terms "center", "portrait", "horizontal", "top", "bottom", "front", "rear", "left", "right", " The orientation or positional relationship indicated by vertical, horizontal, top, bottom, inner, outer, etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and The description is simplified rather than indicating or implying that the device or element referred to must have a particular orien...

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Abstract

A chip color detection device disclosed by the invention comprises: a feeding module, a detection module and a feeding module which are sequentially arranged on the top of the detection device, and the feeding module includes a feeding conveying mechanism, a replenishing conveying mechanism and an upper feeding module. A material grabbing mechanism; a material feeding buffer mechanism is arranged on the feeding conveying mechanism, and the buffer pushing mechanism can push the wafer box on the feeding push chain into the buffer chamber for buffering; the detection module includes a detection support frame and a detection support frame arranged on the detection support At least one visual inspection mechanism on one side of the frame, the visual inspection mechanism can take pictures and test the wafer, and the inspection module also includes a marking mechanism. The wafers are sorted; a box conveying chain is arranged on one side of the unloading conveying mechanism, and a plurality of storage boxes are arranged on the box conveying chain, and the wafer box is pushed into the storage box by pushing the manipulator.

Description

technical field [0001] The invention relates to the field of wafer color detection, and more particularly, to a wafer color detection device. Background technique [0002] With the advancement of technology, more and more electronic products have come out, and there is also a trend towards miniaturized design. The miniaturization of electronic products is mainly due to the large use of miniaturized electronic components such as chips, diodes, transistors or light-emitting diodes made of semiconductor materials in their internal circuits, which can greatly reduce the overall circuit volume and save the installation space. in order to achieve miniaturization. [0003] It is well known that, during the production of semiconductor electronic materials, it is mainly after the completion of the wafer fabrication to check whether each die in the wafer meets the factory or layout standards, and after the inspection is completed, screen out the qualified die in the wafer. , in orde...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/677H01L21/683
CPCH01L21/67288H01L21/67706H01L21/6838Y02P70/50
Inventor 秦应化刘杰杰刘传磊
Owner SUZHOU DINNAR TECH FOR AUTOMATION CO LTD
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