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Substrate-free adhesive tape repasting equipment and adhesive tape repasting method thereof

A technology without substrates and tapes, applied in the direction of bonding methods, adhesives, climate sustainability, etc., can solve the problems of glue pulling, unsatisfactory effects, and glue wrinkles, so as to improve the efficiency of posting and shorten the pre-lamination the effect of time

Pending Publication Date: 2022-06-03
SUZHOU DAXIANG NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Generally speaking, the conventional method is to transfer to a 40-60g release film using double-sided adhesive without substrate, and it also requires a long time of pre-lamination. If you want to transfer to a lighter weight release film On the other hand, the effect is not very ideal, and there may be adverse phenomena such as product pull and glue wrinkle

Method used

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  • Substrate-free adhesive tape repasting equipment and adhesive tape repasting method thereof

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Embodiment Construction

[0016] The following describes in detail the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary, and are intended to explain the present invention and should not be construed as limiting the present invention. In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "upper surface", etc. is based on the orientation or positional relationship shown in the accompanying drawings, only In order to facilitate the description of the present invention and simplify the description, it is not indicated or implied that the indicated device or element must have a particular orientation, be construct...

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PUM

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Abstract

The invention discloses substrate-free adhesive tape repasting equipment and an adhesive tape repasting method thereof. The substrate-free adhesive tape repasting equipment comprises a circular knife machine, and a first station, a second station and a third station which are mounted on the circular knife machine, the number of the second stations is two, and the two second stations are arranged at the two ends of the circular knife machine. The first station is located on the left side of the third station. The first station comprises a first steel rod and a hot pressing roller which are positioned on the circular knife machine; wherein the space between the first steel rod and the hot pressing roller is used for feeding materials; the second station comprises a second steel roller and a rubber roller; and the space between the second steel roller and the rubber roller is used for feeding materials. The hot-pressing roller is utilized and heated, so that the activity of the double-faced adhesive tape can be improved, the double-faced adhesive tape can be quickly transferred and pasted to a low-gram-weight release film, the pre-pasting time is greatly shortened, and meanwhile, adhesive pulling and adhesive overflowing are avoided; the invention further discloses a repasting method of the base-material-free adhesive tape, so that the compounding effect of the base-material-free adhesive tape and the low-gram-weight release film is more ideal and reliable.

Description

technical field [0001] The invention relates to the technical field of tape transfer equipment and tape transfer method, in particular to a base material-free tape transfer device and a tape transfer method. Background technique [0002] Substrate-free double-sided tape is made of water-resistant kraft paper, white glassine paper or transparent PET that is directly coated with acrylic glue and then attached with polymer coating without any medium, such as PET, foam, cotton Therefore, it has the characteristics of good processability, good temperature resistance, good dimensional stability, thermal stability, chemical stability, and good initial viscosity and stickiness. [0003] Generally speaking, the conventional method, the use of non-substrate double-sided tape is to transfer to the 40-60g release film, and it also requires a long time of pre-lamination, if you want to transfer to a lighter weight release film However, the effect is not very ideal, and there may be unde...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J5/00
CPCC09J5/00Y02P70/50
Inventor 胡荣陈进财张祥
Owner SUZHOU DAXIANG NEW MATERIAL
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