A fully automatic wafer wax sticking machine

Abstract

The invention discloses a fully automatic wafer waxing machine, comprising a wafer supply unit, a robot arm, a wafer cleaning unit, a centering unit, a wax dripping unit, a double-arm wafer transferring unit, a wafer turning unit, a wafer Pressing unit, ceramic disc heating unit, turnover unit, cooling unit and carrier, the wafer passes through the wafer supply unit, robot arm, wafer cleaning unit, centering unit, dual-arm wafer transfer unit, wax dripping unit, wafer The circle turning unit, the heating unit of the ceramic disc, the pressing unit of the wafer, the turnover unit and the cooling unit are assembled with the ceramic disc; the present invention realizes automatic feeding, automatic cleaning, automatic wax dripping, automatic baking, automatic turning, automatic The functions of pressing, automatic heating, automatic turnover and automatic cooling are integrated, which greatly improves the production efficiency of the product and realizes automatic production.

Description

technical field [0001] The invention relates to an automatic wafer wax sticking machine. Background technique [0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its raw material is silicon. High-purity polysilicon is dissolved and mixed with silicon crystal seeds, which are then slowly pulled out to form cylindrical monocrystalline silicon. After the silicon ingot is ground, polished and sliced, a silicon wafer, that is, a wafer, is formed. The domestic wafer production line is mainly 8 inches and 12 inches. [0003] With the rapid growth of installed capacity in China's semiconductor market, labor shortages and rising labor costs, manufacturers have increased demand for automation equipment, which has a significant effect on reducing production costs and improving product yields. [0004] Existing wafers (sapphire wafers, silicon wafers, etc.) require multiple processes during processing, such as cleaning, gluing, patching, shoveli...

AI Technical Summary

Problems solved by technology

However, in the prior art, there are also automation equipment for wafer placement, cleaning, shoveling, and ceramic disk cleaning and storage, but these equipment structures are relatively complicated, and the working procedures are cumbersome when used; The requirements on the surface of the wafer are relatively high, and collisions or dust on the surface of the wafer cannot be avoided during the transfer process, which affects product quality, which makes the processing efficiency of the wafer extremely low; for example, the application number is: "CN201910746988.9". Automatic wafer cleaning and placement machine: "Including ceramic disk cleaning conveyor line and wafer chip placement line, the ceramic disk cleaning conveyor line is used to clean the ceramic disk and send the ceramic disk to the wafer chip placement line, There are two wafer placement lines, which are respectively arranged at the output end of the ceramic disk cleaning conveying line, and are used for attaching wafers to the cleaned ceramic disk; the ceramic disk cleaning conveying line is provided with a ceramic disk A feeding mechanism and a ceramic disk cleaning mechanism, the ceramic disk feeding mechanism is used to take out the stored ceramic disks, and the ceramic disk cleaning mechanism is correspondingly arranged at the output end of the ceramic disk feeding mechanism, and is used to receive the ceramic disk feeding mechanism The incoming ceramic discs are cleaned vertically; the wafer placement line is equipped with a carrying basket mechanism, a scrubbing and drying mechanism, a wax spreading mechanism, a baking mechanism, a shaping edge-seeking mechanism, and a patch flat mechanism , transfer manipulator and ceramic plate discharge mechanism,......

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