LED chip transfer method, transfer substrate preparation method and display device

A technology of LED chip and transfer method, which is applied in semiconductor devices, semiconductor/solid-state device manufacturing, instruments, etc., can solve the problems of large material consumption, increased transfer cost, and high production cost of display equipment, so as to improve transfer efficiency and simplify transfer steps , the effect of reducing transfer costs

Pending Publication Date: 2022-04-12
SHENZHEN SITAN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, when the micro-LED chips are transferred to the display backplane through mass transfer, not only a large amount of material needs to be consumed, but also additional transfer costs will be increased, resulting in higher production costs of display devices

Method used

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  • LED chip transfer method, transfer substrate preparation method and display device
  • LED chip transfer method, transfer substrate preparation method and display device
  • LED chip transfer method, transfer substrate preparation method and display device

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Embodiment Construction

[0044] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0045] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. The terms "vertical," "horizontal," "left," "right," and similar...

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PUM

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Abstract

The invention provides an LED chip transfer method, a transfer substrate preparation method and a display device, and belongs to the field of LED display. The LED chip transfer method comprises the following steps that a bearing plate is obtained or prepared, and an LED chip is arranged on the bearing plate; a transfer substrate is obtained or prepared, and protrusions on the transfer substrate are attached to the LED chips arranged on the bearing plate; stripping the LED chip from the bearing plate, and transferring the stripped LED chip to the bulge; a transfer head is obtained or prepared, a boss on the transfer head is attached to the LED chip transferred to the protrusion, and the LED chip is transferred to the boss; and separating the transfer substrate from the transfer head, separating the LED chips from the bulges, and transferring the LED chips to the transfer head. According to the LED chip transfer method provided by the invention, the transfer steps of the LED chip are simplified, and the transfer efficiency of the LED chip is improved, so that the transfer cost of the LED chip is reduced.

Description

technical field [0001] The invention relates to the field of LED display, in particular to an LED chip transfer method, a transfer substrate preparation method and a display device. Background technique [0002] Light Emitting Diode (LED) is widely used in display devices because of its good stability, long life, low power consumption, high color saturation, fast response, strong contrast, etc. . In the production process of LED display devices, it is necessary to directly transfer the lit LED crystal film to the display backplane without packaging. In the production of MiS3ro LED, millions or even tens of millions of micron-sized LEDs Chips are moved correctly and efficiently onto the display backplane, a process known as mass transfer. [0003] In the prior art, when the micro-LED chips are transferred to the display backplane by mass transfer, not only a large amount of material needs to be consumed, but also the transfer cost will be additionally increased, resulting i...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L21/683G09F9/33
Inventor 刘召军李岳
Owner SHENZHEN SITAN TECH CO LTD
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