Capacitance-based PCB (Printed Circuit Board) for improving integrity of cross-segmentation signal and layout method thereof

Abstract

The invention relates to a PCB (Printed Circuit Board) for improving the integrity of a cross-segmentation signal based on a capacitor and a layout method thereof, at least one high-speed transmission signal line is arranged on the PCB, and the high-speed transmission signal line refers to different power supply planes; according to the layout method, two capacitor banks are additionally arranged on the top layer (or the bottom layer) of the PCB, each capacitor bank comprises N capacitors with capacitance values gradually increased from small to large, and the capacitance value of each capacitor is M times of the capacitance value of the previous capacitor. Therefore, according to the design scheme, a backflow path of a high-speed signal can be reduced, impedance abrupt change of the transmission line can be effectively controlled, the integrity of the transmission signal is improved, and stable and reliable data transmission of a link is ensured.

Description

technical field [0001] The present invention relates to the field of semiconductor automatic test equipment (Automatic Test Equipment, referred to as ATE), and in particular to a printed circuit board (PCB) and a layout method for improving the integrity of cross-segmented signals based on capacitance. Background technique [0002] For complex PCB systems, there are usually a large number of high-speed signals. In the PCB layout process of high-speed circuits, in order to reduce costs, there is usually a problem of cross-segmentation. Cross-segmentation may not matter for low-speed transmission signals, but in high-speed transmission digital signal systems, high-speed transmission signals use the reference plane as the return path (return path). If there is a split in the reference plane, the signal reference plane will not be correct. continuous. [0003] That is, when the reference plane is incomplete, cross-segmentation will increase the return path of the signal, result...

AI Technical Summary

Problems solved by technology

[0007] ① Under normal circumstances, the ground around the high-speed signal transmission line will take up more space on the printed board, increasing design and production costs;

[0008] ②. If the high-speed signal transmission line refers to the power layer, there will still be a large return path through the ground wrapping process, and the improvement effect is not obvious;

[0009] ③. After wrapping the ground around the high-speed signal transmission line, the impedance of the high-speed signal transmission line should not only refer to the power supply or ground plane, but also refer to the ground wire around the high-speed signal transmission line. This will affect the impedance control of the high-speed signal transmission line, and the impedance error will be biased. Big;

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