Method for manufacturing rigid-flex board with rigid board surrounded by flexible board

A technology of a rigid-flex board and a manufacturing method, which is applied in the direction of multi-layer circuit manufacturing, etc., can solve the problems of increasing the difficulty of process manufacturing and manufacturing cost, increasing the number of layers and thickness, and being unfavorable for mass manufacturing, so as to achieve mass manufacturing, The effect of reducing thickness and number of layers, improving production efficiency and product yield

Pending Publication Date: 2022-04-05
江西强达电路科技有限公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the existing technology, it is usually required that the width of the soft board in the connection area between the soft board and the hard board is smaller than the width of the hard board. This method is solved by increasing the number of soft boards in the first inner layer when the width of the soft board is not enough to distribute. To a certain extent, the number of layers and the thickness continue to increase, which is not conducive to the development in the direction of "thin". With the increase of the number of layers, the difficulty of process production and production cost are increased, which is not conducive to mass production

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for manufacturing rigid-flex board with rigid board surrounded by flexible board
  • Method for manufacturing rigid-flex board with rigid board surrounded by flexible board
  • Method for manufacturing rigid-flex board with rigid board surrounded by flexible board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] A rigid-flex board surrounded by soft boards, including a first inner hard board 110, an inner soft board 20 and a second inner hard board 120, the first inner hard board 110, the second inner The hard board 120 can be a single-sided, double-sided or multi-layer board, and the inner flexible board 20 can be a single-sided flexible board, double-sided flexible board or multi-layer flexible board; the inner flexible board 20 can be divided into The first inner flexible board 210 , the second inner flexible board 220 , the third inner flexible board, the fourth inner flexible board and the fifth inner flexible board.

[0043] The first inner hard board 110, the inner soft board 20, and the second inner hard board 120 are fixedly connected by a weak flow glue prepreg with a fluidity of less than 10%, and the glue fluidity of the weak flow glue prepreg is 3- 6%; the first prepreg 310 and the second prepreg 320 correspond to the first exposed area 211 of the soft board and th...

Embodiment 2

[0048] A rigid-flex board surrounded by soft boards, its structure is basically the same as that of Embodiment 1, the difference is that the first inner hard board 110 and the second inner hard board 120 are light boards without graphics near the prepreg.

[0049] The processing technology of the hard board surrounded by flexible boards in embodiment 2 is the same as that in embodiment 1.

Embodiment 3

[0051] A rigid-flex board surrounded by soft boards, its structure is basically the same as that of Embodiment 1, the difference is that the inner hard board 10 has a thickness of 0.7mm H / Hoz and does not contain copper.

[0052] The processing technology of the hard board surrounded by flexible boards in embodiment 3 is the same as that in embodiment 1.

[0053] The hard board produced by the manufacturing method of the present invention is surrounded by soft boards, which effectively solves the problem that the width of the soft board in the connection area between the soft board and the hard board is smaller than the width of the hard board, and increases the width of the soft board for wiring, which can effectively Reduce the thickness and number of layers of the board, reduce the difficulty of production, improve production efficiency and product yield, and then realize the overall effect of product quality improvement, product price reduction, and competitiveness improvem...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a manufacturing method of a rigid-flex board with a rigid board surrounded by a flexible board. The manufacturing method comprises the following steps: manufacturing a first inner-layer flexible board cutting cover film; pasting a covering film; fast pressing; quickly pressing the first soft board pasted with the cover film; baking the plate; baking the quickly pressed plate to obtain a soft plate layer; manufacturing a prepreg; performing laser cutting windowing on the first prepreg and the second prepreg corresponding to the first exposed area of the soft board and the rivet hole, wherein a connecting bridge connected with the hard board area needs to be designed in the laser cutting windowing; manufacturing a first inner-layer hard board; manufacturing a second inner-layer hard board; a first inner layer hard board depth control gong; controlling the depth of the second inner layer hard board; the steps are performed after integral pressing and before depth-controlled uncovering by using the prior art; opening the cover by controlling the depth; and forming, testing, appearance inspection and packaging are carried out on the uncovered rigid-flex board semi-finished product, and production of the rigid-flex board is completed.

Description

technical field [0001] The invention relates to a manufacturing method of a rigid-flex circuit board, in particular to a method for manufacturing a rigid-flex circuit board in which a rigid board is surrounded by a soft board. Background technique [0002] As people demand more and more functions for electronic products, electronic products need to be highly integrated. As an important and indispensable printed circuit board for electronic products, the development of "light, thin, short and small" is also proposed. Direction, thanks to the comprehensive advantages of PCB board and FPC board, soft and hard board came into being and has been widely used in electronic products. Therefore, it can be used in some products with special requirements, and has a certain degree of flexibility. The area also has a certain rigid area, which is of great help to save the internal space of the product, reduce the volume of the finished product, and improve the performance of the product. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
Inventor 江清兵宋振武郭先锋
Owner 江西强达电路科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap