Method for manufacturing rigid-flex board with rigid board surrounded by flexible board

Abstract

The invention provides a manufacturing method of a rigid-flex board with a rigid board surrounded by a flexible board. The manufacturing method comprises the following steps: manufacturing a first inner-layer flexible board cutting cover film; pasting a covering film; fast pressing; quickly pressing the first soft board pasted with the cover film; baking the plate; baking the quickly pressed plate to obtain a soft plate layer; manufacturing a prepreg; performing laser cutting windowing on the first prepreg and the second prepreg corresponding to the first exposed area of the soft board and the rivet hole, wherein a connecting bridge connected with the hard board area needs to be designed in the laser cutting windowing; manufacturing a first inner-layer hard board; manufacturing a second inner-layer hard board; a first inner layer hard board depth control gong; controlling the depth of the second inner layer hard board; the steps are performed after integral pressing and before depth-controlled uncovering by using the prior art; opening the cover by controlling the depth; and forming, testing, appearance inspection and packaging are carried out on the uncovered rigid-flex board semi-finished product, and production of the rigid-flex board is completed.

Description

technical field [0001] The invention relates to a manufacturing method of a rigid-flex circuit board, in particular to a method for manufacturing a rigid-flex circuit board in which a rigid board is surrounded by a soft board. Background technique [0002] As people demand more and more functions for electronic products, electronic products need to be highly integrated. As an important and indispensable printed circuit board for electronic products, the development of "light, thin, short and small" is also proposed. Direction, thanks to the comprehensive advantages of PCB board and FPC board, soft and hard board came into being and has been widely used in electronic products. Therefore, it can be used in some products with special requirements, and has a certain degree of flexibility. The area also has a certain rigid area, which is of great help to save the internal space of the product, reduce the volume of the finished product, and improve the performance of the product. ...

AI Technical Summary

Problems solved by technology

[0003] In the existing technology, it is usually required that the width of the soft board in the connection area between the soft board and the hard board is smaller than the width of the hard board. This method is solved by increasing the number of soft boards in the first inner layer when the width of the soft board is not enough to distribute. To a certain extent, the number of layers and the thickness continue to increase, which is not conducive to the development in the direction of "thin". With the increase of the number of layers, the difficulty of process production and production cost are increased, which is not conducive to mass production

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