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Plating solution full-automatic analysis method and computer readable storage medium

A fully automated and analytical method technology, applied in the direction of material analysis, material analysis by electromagnetic means, material electrochemical variables, etc., can solve problems such as difficult to realize automatic analysis, and achieve the effect of ensuring the accuracy and correctness of the analysis

Pending Publication Date: 2022-04-05
深圳日山科技有限公司
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Problems solved by technology

[0006] In view of this, the present invention proposes a fully automatic analysis method for plating solution. By setting high and low positive potentials in the pure electroplating solution and running CVS to clean the rotating disc electrode and obtain the reference potential offset, the potential parameters in the subsequent measurement compensate the reference potential Offset operation to solve the technical problem that the existing technology is difficult to achieve continuous automated analysis

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  • Plating solution full-automatic analysis method and computer readable storage medium
  • Plating solution full-automatic analysis method and computer readable storage medium
  • Plating solution full-automatic analysis method and computer readable storage medium

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Embodiment Construction

[0024] In order to make the technical solution of the present invention more comprehensible, the following examples are given together with the accompanying drawings to further illustrate the present invention. The specific embodiment of the present invention proposes a fully automatic analysis method for plating solution, aiming at realizing continuous automatic analysis of additives in the plating solution, figure 1 is a flowchart of the method. Please refer to figure 1 , the method includes the following steps S1-S5:

[0025] Step S1, in the pure plating solution, run electrochemical voltammetry with specified parameters, and obtain the reference potential offset and the stripping electric quantity from the potential, current and time data. It should be understood that the plating solution here may be copper electroplating solution, zinc electroplating solution, tin electroplating solution or nickel electroplating solution, etc., and is not limited thereto. The electroch...

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Abstract

The invention discloses a plating solution full-automatic analysis method and a computer readable storage medium, and the method comprises the following steps: S1, in a pure plating solution, operating an electrochemical voltammetry by adopting specified parameters, and obtaining a reference potential offset and a stripping electric quantity from potential, current and time data; s2, judging whether the reference potential offset is greater than a first preset threshold value or not; if yes, compensating the reference potential offset in the electrochemical voltammetry parameters and then returning to S1; otherwise, entering the step S3; s3, judging whether the error between the stripping electric quantity and the standard value is greater than a second preset threshold value or not; if yes, using the electrochemical voltammetry parameters for cleaning the electrode to operate the electrochemical voltammetry to clean the electrode, and then returning to S1; otherwise, entering the step S4; s4, operating the electrochemical voltammetry activation electrode by adopting the electrochemical voltammetry parameters for analyzing the sample, and then operating the electrochemical voltammetry to analyze the concentration of the sample; s5, judging whether a next sample exists or not; if yes, the steps S1 to S4 are repeated; and if not, finishing the analysis.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a fully automatic analysis method for a plating solution and a related computer-readable storage medium. Background technique [0002] In the electroplating process, the control of the concentration of additives in the plating solution is particularly important. The concentration of additives directly affects the qualified rate of electroplating, and ultimately can affect the qualified rate of products. [0003] CVS (Cyclic Voltammetry Stripping, cyclic voltammetry stripping) electroplating analysis technology is an electrochemical method to determine the concentration of additives by analyzing the influence of additives on the electroplating deposition rate on the rotating disk electrode. CVS can be used to analyze organic additives in electroplating solutions, such as leveling agents, brighteners, carriers, etc. The concentration of these organic additives can directly ...

Claims

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Application Information

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IPC IPC(8): G01N27/416G01N27/38
Inventor 孙耀峰周卫娟
Owner 深圳日山科技有限公司
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