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Manufacturing method of display substrate, display substrate and display device

A technology for display substrates and manufacturing methods, which is applied to electrical components, electrical solid devices, circuits, etc., can solve the problems of small size of Micro-LED chips, achieve the effects of reducing area, improving light blocking effect, and improving display effect

Pending Publication Date: 2022-03-29
SHENZHEN SITAN TECH CO LTD
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Problems solved by technology

[0003] However, due to the small size of Micro-LED chips, the size of a single Micro-LED chip is usually in the range of several to tens of microns, and the spacing between Micro-LED chips is even smaller, usually smaller than the size of a single Micro-LED chip. How to prevent cross-light phenomenon between Micro-LED chips becomes a difficult problem

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  • Manufacturing method of display substrate, display substrate and display device
  • Manufacturing method of display substrate, display substrate and display device
  • Manufacturing method of display substrate, display substrate and display device

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Embodiment Construction

[0033] It should be noted that, in the case of no conflict, the embodiments in the present disclosure and the features in the embodiments can be combined with each other. The present disclosure will be described in detail below with reference to the accompanying drawings and embodiments.

[0034] It should be noted that the following detailed description is exemplary and intended to provide further explanation of the present disclosure. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs.

[0035] For the convenience of description, spatially relative terms may be used here, such as "on ...", "over ...", "on the surface of ...", "above", etc., to describe the The spatial positional relationship between one device or feature shown and other devices or features. It will be understood that the spatially relative terms are intended to encompass d...

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Abstract

The invention provides a manufacturing method of a display substrate, the display substrate and a display device. The manufacturing method of the display substrate comprises the steps that a plurality of light-emitting units are arranged on a substrate, a part of a first semiconductor layer is exposed, and the light-emitting units form a table top; a first light blocking structure is arranged in a groove between the table tops of the light emitting units; an electrode layer is arranged on the light-emitting unit and the first semiconductor layer, and a Micro-LED array is obtained; and the Micro-LED array is bonded with a circuit substrate, and the substrate is peeled off. According to the technical scheme, the light blocking structures are arranged between the light emitting units, the optical crosstalk phenomenon between the light emitting units can be effectively avoided, and the display effect of the display substrate is improved.

Description

technical field [0001] The present disclosure relates to the technical field of LEDs, in particular, to a manufacturing method of a display substrate, a display substrate and a display device. Background technique [0002] Micro-LED (Micro Light Emitting Diode) is a new self-luminous display technology. Due to the characteristics of Micro-LED chip size, high integration and self-luminescence, compared with LCD and OLED, it has advantages in brightness, resolution, contrast, It has greater advantages in terms of energy consumption, service life, response speed and thermal stability. [0003] However, due to the small size of Micro-LED chips, the size of a single Micro-LED chip is usually in the range of several to tens of microns, and the spacing between Micro-LED chips is even smaller, usually smaller than the size of a single Micro-LED chip. How to prevent the cross-light phenomenon between Micro-LED chips has become a difficult problem. Contents of the invention [000...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L33/58H01L27/15
CPCH01L33/0093H01L33/58H01L27/156H01L2933/0058
Inventor 李辉张珂
Owner SHENZHEN SITAN TECH CO LTD
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