Method and system for detecting surface defects of article

Abstract

The invention discloses a method and a system for detecting surface defects of an article. The method for detecting the surface defects of the article comprises the following steps of: providing the article; the system for detecting the surface defects of the object comprises a laser emission module, a laser detection module and an analysis module, the laser detection module is electrically connected with the laser emission module, and the analysis module is electrically connected with the laser detection module; emitting laser to the surface of the object by using a laser emitting module; using a laser detection module to detect a plurality of irradiation positions when the laser irradiates the surface; analyzing, using an analysis module, a surface feature of the surface based on the plurality of illumination locations; and determining whether the surface has surface defects based on the surface features. The invention also provides a system for detecting the surface defects of the article, compared with a known automatic optical detection system or human eye identification, the detection resolution is not influenced by the illumination brightness or the shooting angle, the resolution is better, and finer surface defects can be distinguished.

Description

technical field [0001] The present invention relates to methods and systems for detecting surface defects. More specifically, the present disclosure relates to methods and systems for detecting surface defects using laser light. Background technique [0002] In the semiconductor process, some processes, such as high temperature or friction or collision during component transfer, may cause surface defects (such as thermal melting marks or scratches) on the wafer or components in the wafer processing equipment, affecting the quality of subsequent processes. yield. For example, when there is a surface defect on the inner edge of the wafer storage carrier, it is easy to cause the mechanical arm to be interfered by the surface defect when accessing the wafer, resulting in wafer fragmentation. [0003] The current methods for inspecting surface defects mainly rely on human eye interpretation or automatic optical inspection systems. However, when the surface defect is not obviou...

AI Technical Summary

Problems solved by technology

However, when the surface defect is not obvious, it is easy to miss the inspection by human eyes. As for the automatic optical inspection system, there are limitations of lighting and picking angle. If the lighting is insufficient or the picking angle is not appropriate, it is easy to miss the inspection. In addition, Resolution is also limited

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