Method for judging open circuit defect of through hole

Abstract

The invention relates to the technical field of integrated circuits, in particular to a method for judging open circuit defects of through holes. Comprising the following steps: defining a metal contour step length, and differentiating a metal contour to obtain a metal contour area; calculating the contour area of the through hole, and replacing the contour of the through hole with a square with the same area as the contour of the through hole; calculating the overlapping area of the square and the metal contour; potential open circuit defect probabilities in the metal contour direction and the direction perpendicular to the metal contour direction are calculated based on the overlapping area, so that whether the open circuit of the through hole is defective or not is judged, overlay errors can cause that the through hole cannot accurately fall in a preset design position and finally fall in a certain range, and the defect probability of the open circuit is calculated to judge whether the open circuit of the through hole is defective or not. The problem that in the prior art, only whether an open circuit occurs at a preset position or not can be determined, and the open circuit risk under process fluctuation cannot be determined is solved.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to a method for judging the open defect of a through hole. Background technique [0002] For the calculation and judgment of optical proximity effect correction, the main method includes the following steps: [0003] (1) Calculate the overlapping area of ​​the contour of the via after exposure / etching and the contour of the metal metal; [0004] (2) Calculate the ratio of the overlapping area to the area of ​​the original design size via, expressed as [0005] Area ratio = overlapping area / area of ​​original design size via [0006] (3) Calculate according to the process variation range, and finally set the safety threshold of the area ratio (threshold); [0007] (4) If the actual area ratio is higher than or equal to the safety threshold threshold: [0008] Area ratio ≥ safety threshold threshold [0009] The through hole via can be judged as no open circuit defe...

AI Technical Summary

Problems solved by technology

[0013] The purpose of the present invention is to provide a method for judging the open circuit defect of a through hole, which aims to solve the problem that the existing technology can only determine whether the predetermined position is open circuit, but cannot determine the open circuit risk under process fluctuations

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