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Low-viscosity and high-thixotropy composition

A composition, high thixotropic technology, applied in the direction of polymer adhesive additives, adhesive additives, coatings, etc., can solve problems such as affecting product process usability, disappearing thixotropy, and increasing system viscosity.

Active Publication Date: 2022-02-15
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Due to the requirements of construction characteristics, the adhesive or coating industry often requires sufficient thixotropy for the final product, so as to achieve the anti-sagging of glue or coating during the use process Performance requirements. At present, the existing technology mostly uses fumed silica to form a three-dimensional network structure (hydrogen bond) to improve the thixotropy of the system. This three-dimensional network structure (hydrogen bond) can ) will be destroyed, the medium will become thinner, and the thixotropy will disappear. In addition, the use of fumed silica will not only improve the thixotropy of the system, but also increase the viscosity of the system. With a high thixotropic index, the viscosity will also increase rapidly, which affects the process usability of the final product

Method used

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  • Low-viscosity and high-thixotropy composition
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Add 30g of methyl methacrylate, 10g of hydroxyethyl methacrylate, 5g of 2-methyl-2-acrylic acid-2-hydroxyethyl phosphate into the reaction stirred tank, stir for 0.5h, and control the temperature at 40-50 ℃, then add ABS Blendex 338 12g, SBS D1116 8g and stir at high speed for 1 hour, the temperature is controlled at 40-50 ℃, after the materials are evenly stirred, vacuumize for 5 minutes at last, and then discharge to obtain a low-viscosity high-thixotropic composition.

Embodiment 2

[0018] Add 35g of tetrahydrofuryl methacrylate, 10g of hydroxyethyl methacrylate, and 5g of hydroxypropyl methacrylate into the reaction stirred tank, stir for 0.5h, and control the temperature at 40-50°C, then add MBS M-52110g, SBS DZ -3003 10g high-speed stirring for 1 hour, the temperature is controlled at 40-50 ℃, after the material is evenly stirred, vacuumize for 5 minutes at last, and then discharge the material to obtain a low-viscosity high-thixotropic composition.

Embodiment 3

[0020] Add 18g of methyl methacrylate, 20g of hydroxyethyl methacrylate, and 15g of tetrahydrofuryl methacrylate into the reaction stirred tank, stir for 0.5h, and control the temperature at 40-50°C, then add ABS WD-13212g, MBS M- 711 8g and SBSLCY-3411 14g were stirred at high speed for 1 hour, and the temperature was controlled at 40-50°C. After the materials were evenly stirred, they were finally vacuumed for 5 minutes, and then discharged to obtain a low-viscosity, high-thixotropic composition.

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Abstract

The invention relates to a low-viscosity and high-thixotropy composition which comprises a component A and a component B, and the mass ratio of the component A to the component B is 1:1-5:1; the component A is one or a mixture of more of methyl methacrylate, 2-methyl-2-acrylic acid-2-hydroxyethyl phosphate, tetrahydrofurfuryl methacrylate, hydroxyethyl methacrylate and hydroxypropyl methacrylate; and the component B is one or a composition of more of a terpolymer ABS, a block copolymer SBS and a core-shell structure copolymer MBS. According to the prepared composition, by adjusting the adding proportion of the copolymer resin in the acrylic resin, dissolved copolymer molecules can reach a microphase separation state, macroscopically, and the composition is in a uniform and stable non-layering and non-precipitation state; and meanwhile, the composition has the characteristics of low viscosity and high thixotropy.

Description

technical field [0001] The invention relates to a low-viscosity and high-thixotropic composition, which belongs to the technical field of adhesives. Background technique [0002] Due to the requirements of construction characteristics, the adhesive or coating industry often requires sufficient thixotropy for the final product to meet the requirements for the sagging performance of glue or coating during the use process. At present, fumed silica is mostly used in the existing technology. Form a three-dimensional network structure (hydrogen bond) to improve the thixotropy of the system. This three-dimensional network structure (hydrogen bond) will be destroyed by external forces (shear force, electric field force, etc.), the medium will become thinner, and the thixotropy will disappear. In addition, use Fumed silica will also increase the viscosity of the system while improving the thixotropy of the system. In the process where the thixotropy is particularly high, the viscosit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D7/65C09J11/08C08F220/14C08F220/32C08F220/20C08F230/02
CPCC09D7/65C09J11/08C08F220/14C08F220/32C08F220/20C08F230/02C08L33/066C08L55/02C08L53/02C08L51/04
Inventor 陈加立王建斌陈田安解海华
Owner YANTAI DARBOND TECH
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